by Jeff Zopff | Aug 19, 2014 | APL News, Press Release
Seminars to focus on key challenges and solutions for the Chinese electronics manufacturing market August 19, 2014 – Universal Instruments invites electronics manufacturers to join the company for an informative technology seminar held on August 26–27 in Rose...
by Jeff Zopff | Jun 19, 2014 | APL News, Press Release
Industry-leading knowledge resource at the forefront of new and emerging packaging technologies June 19, 2014 – Universal Instruments’ Advanced Process Lab (APL) received the “Best Presentation” award at the SMTA China East 2014 Technology Conference, held at...
by Jeff Zopff | May 20, 2014 | Press Release
With the recent integration of two Universal Instruments surface mount platform lines, global EMS provider Elrad has doubled its production capacity and reduced changeovers by more than 70%. May 20, 2014 – To meet the dynamic demands of the current market,...
by Jeff Zopff | May 13, 2014 | Press Release
Continuing its commitment to providing high quality services, Advanced Process Lab is now certified to help IPC identify a network of trusted electronics manufacturing suppliers. May 13, 2014 – Universal Instruments’ Advanced Process Lab (APL) was recently...
by Jeff Zopff | May 1, 2014 | Press Release
Versatile platform portfolio extends capabilities to deliver cost-effective performance for a full range of application challenges April 25, 2014 – Universal Instruments will display its Fuzion® Platform at the SMT Hybrid Packaging trade show May 6–8 at the...
by Jeff Zopff | Apr 25, 2014 | Press Release
Martin Anselm, Ph.D., Manager, Universal Instruments’ APL AREA Consortium, will examine the accelerated integration of new materials and components, and the challenges this poses for reliability testing April 25, 2014 – Universal Instruments’ Advanced Process...
