Keep track of Universal’s technology tour as we navigate a challenging environment for sharing knowledge with our colleagues and customers. We’ll be using every available platform to let you know what’s new and exciting at Universal. Watch out for our virtual and live trade show schedule.
Visit Universal on Booth 1749 on January 24-26 to learn how to drive operational excellence into your factory. From complex odd-form to mission-critical micro, Universal has the precision automation solution for your unique challenges.
Visit us on Booth 707 on November 2–3 in Minneapolis, MN to discover how Universal is uniquely positioned to deliver solutions for your Precision Automation, Advanced Packaging or PCB Assembly requirements. Experts from our Advanced Process Lab will also be on-hand to discuss your advanced process and materials challenges, while also copresenting a Technical Session on Conformal Coating on November 1.
Visit Universal Instruments and Channel Partner, Elitech Trading Corporation on Booths 49 & 50 at PSECE 2022 (17th Philippine Semiconductor & Electronics Exhibition & Convention) on November 16–18, 2022. Universal offers solutions for a complete range of advanced semiconductor packaging applications leveraging the High-Speed Wafer Feeder (HSWF) combined with the FuzionSC™ Platform – the ultimate multi-die solution for heterogeneous integration.
Universal Instruments is proud to be a Silver Sponsor of 2022 SEMI Vietnam Business Summit, a semiconductor technology exhibition taking place on November 10–11, 2022. Universal Instruments offers comprehensive solutions for 2D, 2.5D and 3D semiconductor applications requiring high accuracy and efficient die handling, from direct die and flip chip to multi-die heterogeneous integration.
Visit Universal at SMT Connect on May 10-12 in Nuremberg, Germany in Hall 4A, Stand 210 to discuss Traditional to Complex SMT assembly, Odd-Form or Precision Automation, or Advanced Packaging requirements. Come see a DEMO of our flexible and reconfigurable Uflex™ platform – the ultimate solution for all of your odd-form automation needs!
Visit Universal at SEMICON West on December 7-9, 2021 in San Francisco, CA to learn about the leading-edge solutions we offer for current and future Advanced Packaging challenges. Some of our core competencies include solutions for 2D, 2.5D, and 3D semiconductor applications requiring high accuracy and efficient die handling. Everything from direct die and flip chip to multi-die heterogeneous integration. Join us at the event for a demo of our High-Speed Wafer Feeder and FuzionSC™ system – the ultimate tool for heterogeneous integration.
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