Since 1919
About Us
Innovation in Electronics Assembly
Build better. Build more. Spend less.
THIS IS US
At Universal, we strive to build upon our proud heritage of engineering and disruptive innovation to drive the future of the electronics industry, and to deliver products that inspire our customers to build better!
We are a technology leader in the design and manufacture of precision automation solutions for the semiconductor and electronics manufacturing industry. With a lineage of more than 100 years, we are the longest-standing electronics assembly company. Our technology solutions are truly universal and span the range of assembly applications- from lighting to automotive, medical, computing, entertainment, mobility, industrial and more.
We employ a highly technical workforce composed of experienced professionals with deep expertise across engineering, operations, and specialized technical disciplines. This expertise and passion to develop innovative solutions to solve our customer’s problems drive our 500+ strong patent portfolio. With 27,000+ systems delivered to date, we offer the broadest range of world-class equipment and services. We also enjoy strategic partnerships with today’s industry leaders, which enables us to stay on the leading edge of technology trends and to deliver the best solutions for the production of a wide variety of the most complex electronic circuits in the World.
We offer solutions for a wide range of high-precision assembly needs, including Precision Automation for applications requiring versatile, high-accuracy, high-speed handling, inspection, and assembly. Advanced Packaging for applications requiring efficient and versatile multi-die high-accuracy assembly. Traditional to Complex Printed Circuit Board Assembly for applications requiring high-speed, high-accuracy surface mount placement and through-hole component insertion. Our cutting-edge smart manufacturing software provides real-time data to help manufacturers improve their overall operations. And, our world-renowned Advanced Process Lab (APL) offers solutions for all aspects of a product lifecycle- from prototyping, process development, and analytical services to advanced technology assembly.
We are committed to creating the most innovative solutions for all aspects of electronics assembly; enabling our customers to maximize their return on investment across their entire product lifecycle.
INNOVATING FOR OVER A CENTURY
We are delighted to have been chosen by the Vestal High School Alumni as a part of their new initiative to feature outstanding local businesses! Click here to read.
OUR HISTORY
Universal Instruments traces its roots to the Universal Instruments and Metal Company, a safety pin manufacturer founded in 1919. Through time, the company discontinued safety pin production and made a transition to a machining and tool and die business. By controlling costs during the Great Depression, Universal Instruments continued to grow through World War II, when the company’s tool and die talents were pressed to meet the needs of the state’s small arms manufacturers. This work continued until the 1950s, when Universal Instruments entered the electronics assembly equipment manufacturing industry.
Universal Instruments first built electronic circuit assembly equipment for through-hole components in the 1960s. For nearly three decades Universal Instruments flourishes by the production of axial, radial, and DIP insertion equipment. In 1993 Universal Instruments acquired Dynapert through-hole assembly machine business that opened the Southeast Asian markets. Enhancements in the through-hole world continue to this day, and Universal Instruments holds nearly half of the global through-hole market.
The global electronics industry burgeoned with the transition from through-hole to surface mount components. In the early 1990′s Universal Instruments developed a modular platform-based surface mount technology machine – the GSM Platform. With an installed base of over five thousand machines, Universal’s GSM quickly became the industry standard in the flexible fine pitch arena.
Today, Universal’s core products include a comprehensive surface mount platform portfolio delivering best-in-class performance and value for any budget or production environment; leading-edge advanced semiconductor packaging solutions for a fast-evolving technology landscape; a through-hole lineup that is the industry standard for productivity and reliability; flexible automation cells for odd-form or light mechanical and back-end assembly; line software to manage manufacturing activities and deliver true control over manufacturing profitability; and industry-leading support and services worldwide to help our customers build better, build more, and spend less.
MANAGEMENT TEAM
driven to achieve
Universal’s senior management team possesses rich and diverse industry knowledge and experience coming from leading positions at some of the World’s leading companies. Its mission is to deliver an unprecedented level of commitment and value to our customers. Read more about our impressive team below.
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Shane Nunes, President of Universal Instruments, provides strategic and operational leadership for the organization, guiding the company’s vision, growth, and execution. Since joining Universal in 2023, he has held leadership roles including Vice President of Global Products and Solutions and Chief Operating Officer, where he led operations, quality, product development, supply chain, marketing, and solutions initiatives. His leadership has helped strengthen operational performance, expand Universal’s solutions portfolio, and position the company for growth in advanced packaging, precision automation, and smart manufacturing.
With more than a decade of experience in the semiconductor industry, Shane brings expertise spanning Front-End and Back-End semiconductor processes, assembly technologies, and capital equipment. He has built a reputation for developing growth strategies, advancing product portfolios, building high-performing teams, and delivering results in global technology markets.
Known for his customer-focused approach and passion for innovation, Shane combines strategic vision with operational excellence to help drive Universal’s continued transformation and long-term success.
Shane holds a Bachelor of Science in Chemistry from the Virginia Military Institute and a master’s degree in management from Harvard University. His blend of industry expertise, leadership experience, and academic achievement positions him to lead Universal Instruments into its next chapter of innovation and growth.
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Brad Bennett, President Emeritus, serves in a consulting capacity to support Universal Instruments’ leadership transition and continued strategic initiatives. He will work closely with Shane Nunes, President, and the executive team on key priorities and customer engagement activities through the end of the year.
During his more than 30-year career with Universal and the electronics manufacturing industry, Bennett held various leadership positions, including President, Business Unit General Manager, and Vice President, and Vice President of Global Field Operations. His leadership strengthened Universal’s market position, expanded customer partnerships, advanced the company’s product portfolio, and fostered a culture of accountability, collaboration, innovation, and continuous improvement. His contributions have left a lasting impact on the organization and established a strong foundation for future success.
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Joe Mott directs all functions of our global human resources department. He supervises and provides consultation to our management team on strategic staffing plans, such as: compensation, benefits, training and personnel development, etc. Throughout his career, Joe has demonstrated exceptional ability as an agent of change and a strategic business partner, helping companies to scale, grow and globalize.
His background includes many years of providing human resources solutions for L-3 Vertex Logistics Solutions and SOS International Ltd. both companies specializing in aerospace, aviation and defense industries for the US Government and which brought him to countries including Iraq, Afghanistan, Kuwait, Dubai, and Columbia.
Joe is an innovative and resourceful professional with extensive HR management experience and expertise in labor relations, policy, procedure, and best practice implementation. Joe holds a Bachelor’s of Applied Science (B.A.Sc) in Human Resources Management and Services from SUNY, Oswego, as well as the following certifications: DDI Certified Trainer, OZ Principle of Accountability Certified Trainer.
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As Vice President of Engineering focused on PCBA products, Phil is responsible for leading our global engineering organization which brings life to our new product and technology offerings across all of Universal’s products lines.
Phil joined us in 2000 and has held several leadership positions of increasing responsibility while remaining closely tied to technology.
He started his career at Universal as an entry level engineer and quickly advanced into a lead engineer role. In 2005 he moved to Shekou China to manage a cross functional team of engineers all while continuing to pursue his graduate degree. Upon his return he became a Technical Manager and Project Manager where he guided the development programs for many of the products in Universal’s product portfolio. In 2017, Phil was promoted to Engineering Product Manager for Uflex and Automation solutions delivering custom solutions across to our global customer base. In 2020, he was named Director of Platform Engineering responsible for all hardware development, and then in 2021, he has taken the reigns to lead the entire engineering organization.
Phil holds a BSME from Clarkson University and a MSME from Binghamton University.
Phil has a proven track record of delivering market dominating products and solutions to our customers through the application of strong leadership skills rooted in technology and program management.
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Kevin Wu, has spent 25 years in the supply chain field and has extensive experience in process, system, and organization development. Kevin has held executive-level roles at several companies, including those in the semiconductor equipment assembly industry, where he spearheaded supply chain transformations.
Prior to joining Universal, Kevin was a Senior Director of Supply Chain at Brother International in NJ, where he led Procurement, Planning, Customer Order Management, and Continuous Improvement organizations. Kevin also held director-level roles at Columbia Tech and Lanxess, and management roles at First Solar and IBM. He was born and raised in mainland China and came to the US to advance his education in engineering and business administration.
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Michael Kane, Vice President, Engineering for Automation and Semiconductor Applications has served more than 40 years in multiple leadership roles across the organization. In this role, he leads a combined team that includes, Pre-Sales Applications, and Applications Engineering Solutions – all focused on better serving our customers and advancing our business objectives.
Mike Joined Universal Instruments in June of 1983 shortly after graduating from SUNY with a Bachelors in Electrical Engineering. He has held multiple positions including Field Engineer, Electrical Engineer, Engineering Management, Program Management, Product Management (SM, IM, APAS) and Solutions Development.
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Jeffrey W. Raetz is currently the Director of Quality Assurance for Universal Instruments and was previously the Director of Operations for the Rochester facility. He began his career with Universal Instruments in June of 2017 as a Supply Chain Manager in Rochester. Prior to joining Universal Instruments, he spent fourteen years with Johnson & Johnson, and thirteen years with the Xerox Corporation. Jeff holds an MBA in Finance and Marketing from the William E Simon Graduate School of Business at the University of Rochester, and a BA in Communication from SUNY Oswego. He has more than thirty years’ experience in Supply Chain, Material Management, and Manufacturing delivering demonstrative improvements for all standard KPIs including Cost Down/Productivity, Quality Processes and Control, Delivery Commitment, and Customer Service.
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Kell Purdy, Director of Manufacturing, is a seasoned Operations Leader with a distinguished career spanning more than four decades in electro-mechanical manufacturing. Kell has held various manufacturing leadership roles including Director of Operations at Amphenol and VP of Manufacturing at Innovation Associates.
Through his leadership in these roles, Kell became known for his strong analytical capabilities, hands-on leadership style, and his commitment to continuous improvement. Kell has built a track record of elevating organizational performance, optimizing resources, and driving customer satisfaction at regional and global scales. Kell joined Universal Instruments in January of 2026 and looks forward to driving UIC’s manufacturing into the future.
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Tom joined Universal in April 2026, bringing 30+ years of leadership in procurement, supply chain strategy, and enterprise transformation across manufacturing, services, and academic healthcare. He has led major initiatives, including system-wide sourcing strategies, supplier optimization, Lean Six Sigma transformations, and shared services/distribution operations, including the launch of a 60,000 sq. ft. consolidated service center and over $12M in product cost savings.
Previously, Tom held senior roles at Xerox, General Electric, and the University of Rochester Medical Center, where he led global procurement strategy, reverse logistics, and enterprise cost-reduction programs. He is known for aligning cross-functional teams, strengthening supplier partnerships, and improving cost, quality, and service performance.
He is a Certified Purchasing Manager, Lean Six Sigma Black Belt, and Industrial Engineer. Tom earned a BS in Industrial Engineering from Rochester Institute of Technology and was active in the Institute of Industrial Engineers and Toastmasters International.
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Rob Dykema is the Director of the Product Team, where he guides a team of cross-functional managers, including product managers and business development leaders. In this role, he drives global strategic growth initiatives, shapes product roadmaps, and ensures the delivery of innovative solutions that maximize value for key customers. He also oversees aftermarket strategy, including parts, support, and service, while championing the voice of the customer across the organization.
Before joining Universal Instruments, Rob held leadership roles at BAE Systems and Lockheed Martin, where he managed large-scale operations with full P&L responsibility for businesses exceeding $200M in revenue. Across these roles, he led global teams, secured major platform wins, launched advanced propulsion systems, and drove sustained revenue growth. Earlier in his career, he held engineering, program management, and production leadership roles in the automotive industry, supporting product development and high-volume manufacturing programs.
Rob holds a Master of Science in Management from Walsh College and a Bachelor of Science in Mechanical Engineering from Michigan State University.
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Kristi Schilloff leads the company’s global corporate communications strategy, driving brand growth, market visibility, and consistent messaging across all channels. She oversees marketing communications worldwide, guiding internal teams and external partners, and driving creative initiatives to ensure alignment with corporate objectives and a cohesive brand presence.
With more than two decades of experience at Universal Instruments, Kristi has a proven track record of executing high-impact marketing programs, managing global campaigns and product launches, and developing compelling sales and promotional materials. She brings strong expertise in digital engagement, including social media, website management, multilingual content, press relations, advertising, and technical communications.
Kristi holds an Associate degree in Marketing Communications from SUNY Broome Community College and is a graduate of the Binghamton University Leadership Development Program.
