Industrial/iot

Industrial electronics span a wide range of products with manufacturers striving to produce high-quality goods that keep them ahead of the competitive curve. Production of these products can involve the handling of large substrates with concentrated surface mount placement areas on small circuits, but can also require LED placement for control displays or more traditional through-hole component technologies for products such as white goods.

Universal helps Industrial electronics manufacturers create a complete solutions environment by giving them the flexibility to take on the challenges of this varied product mix. With a through-hole technology portfolio that is the industry’s enduring standard and a best-in-class surface mount portfolio suited to any mix or volume, Universal is uniquely positioned to maximize productivity, minimize time-to-market and make and control everyday products better.

WHITE GOODS

  • Lidar
  • Radar
  • Cameras
  • Sensors

METERS & CONTROLS

  • Temperature Controllers (Fryers, Freezers, etc.)
  • Water & Power Meters

INSTRUMENTATION

  • Automation
  • Flow
  • Gas Analytics
  • Level Instrumentation
  • Liquid Analytics
  • Pressure
  • Temperature

POWER MANAGEMENT

  • IGBT Power Inverters

WANT TO BUILD BETTER?

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INDUSTRIAL/IOT MARKET APPLICATIONS

 

RESOURCES
Server/Network
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Mobility & Wearables
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Automotive
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Medical
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Mil/Aero
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Industrial/IOT
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Agriculture
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Solar
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility

APPLICATION VIDEOS

INDUSTRIAL ASSEMBLY