sOLUTIONS
PRECISION AUTOMATION SOLUTIONS
ADVANCED PACKAGING SOLUTIONS
PCB ASSEMBLY SOLUTIONS
SOLUTIONS
PRECISION AUTOMATION SOLUTIONS
- Large & high-part count PCB & SSD modules: OFA for Server/Network Infrastructure; DIMM sockets, high-pin-count connectors; SSD e-cap form/cut/insert
- IoT, High-Reliability Industrial, Medical & Mil-Aero PCB & modules: OFA, including high-pin-count connectors. Flex-flex or flex-PCB place & hot bar bonding
- Mobility (Phone, Watch, Earbud) modules: Hot bar & laser bonding: flex-flex, SiP, flex-optic; MP sensor
- Automotive, Lighting & Sensing modules: IGBT module assembly, Lidar, MEMS, HL module assembly
PRECISION AUTOMATION PRODUCTS
FUZIONSC & HSWF
FuzionSC™ and the HSWF™ combine to bring high productivity to advanced packaging assembly, delivering precision passive and active placement on a single platform. This solution supports virtually any feeding option and has the performance to meet high-volume targets.
FUZIONOF
FuzionOF™ is easily configured for SM or odd-form applications, performing both component placement and insertion. It is ideal for light-duty odd-form, supporting a wide range of leaded and non-leaded odd-form devices.
UFLEX
Uflex™ delivers ultimate flexibility for all forms of odd-form insertion and mechanical assembly operations. It supports radial and axial insertion and provides passive and active clinching. Uflex is easily retooled for a variety of processes, including screw driving, labeling, test handling, and more.
SMART INSERTER PLUS
The Smart Inserter Plus brings intelligence, ease of use and simplicity to back-end electronics assembly automation. It enhances the component range of Uflex and FuzionOF, enabling a complete cost-effective solution for any automation requirement.
SMART
PRESS-FIT
INTELLIGENT, RELIABLE PRESS-FIT
The Smart Press-Fit Platform is a premiere solution for challenging press-fit components, offering superior performance and a modern, robust alternative to traditional solder joint connections.
APPLICATION VIDEOS
COMPLEX CONNECTOR ASSEMBLY
ODD-FORM AUTOMATION
HIGH PIN-COUNT MODULE ASSEMBLY
ADVANCED PACKAGING SOLUTIONS
- Large & high-part count electronics: HPC die to substrate flip chip, HPC die on die POP, HPC die on wafer CoWoS
- IoT, Hi-Reliability Industrial, Medical & Mil-Aero modules: Multi-die flip chip sensor assembly, MEMS sensor module assembly, Die on flex & embedded die assembly
- Mobility (Phone, Watch, Earbud) modules: Heterogeneous Integration, wafer and panel fan-out, die on flex and embedded die
- Automotive modules: IGBT die on substrate assembly, Lidar & MEMS module assembly, HL LED on substrate assembly
ADVANCED PACKAGING PRODUCTS
FUZIONSC & HSWF
FuzionSC™ and the HSWF™ combine to bring high productivity to advanced packaging assembly, delivering precision passive and active placement on a single platform. This solution supports virtually any feeding option and has the performance to meet high-volume targets.
FUZIONSC PLATFORM
The FuzionSC™ platform supports a full complement of high-volume flip chip and bare die applications, enabling high-speed die delivery from wafer over a wide range of die sizes to streamline processes and improve efficiency.
FLEXBOND
The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines Fuzion® for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.
APPLICATION VIDEOS
HETEROGENEOUS INTEGRATION
FLEXBOND OPERATION
PANEL FAN-OUT
PCB ASSEMBLY SOLUTIONS
- Large & high-part count PCBA: Server/Network Infrastructure SMT
- IoT, Hi-Reliability Industrial, Medical & Mil-Aero PCBA: High-changeover SMT & NPI
- Mobility (Phone, Watch, Earbud) PCBA: End-of-line multifunction for MLB, interposers, antenna
- Automotive, Lighting: High-changeover SMT & NPI
PCB ASSEMBLY PRODUCTS
GENERATION 9
Dedicated to pre-taped radial and axial components, Universal’s through-hole solutions bring a new level of productivity to radial and axial component sequencing and insertion, offering consistently high throughput.
EPIQX
EPIQx™ is the next-generation high-speed SMT platform that leverages data at the device level to deliver unmatched insight and control at the machine, line and factory level. It is the perfect foundation for the lights-out factory of the future: a self-operating, adaptive, manufacturing environment.
FUZION
TRADITIONAL SURFACE MOUNT
Fuzion® features a versatile portfolio of configurations providing exceptional performance, low cost per placement, extreme flexibility and high accuracy for virtually any environment or product mix.
FUZIONOF
FuzionOF™ is easily configured for SM or odd-form applications, performing both component placement and insertion. It is ideal for light-duty odd-form, supporting a wide range of leaded and non-leaded odd-form devices.
SMART INSERTER PLUS
The Smart Inserter Plus brings intelligence, ease of use and simplicity to back-end electronics assembly automation. It enhances the component range of Uflex and FuzionOF, enabling a complete cost-effective solution for any automation requirement.