Sintering Copper Interconnects in Formic Acid

Sintering Copper Interconnects in Formic Acid

Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a...
Engaging the Electronics Assembly Community

Engaging the Electronics Assembly Community

AREA consortium assembly research is executed for the benefit of our member companies with all results and supporting data archived for on-demand access by the membership. Key observations are routinely selected from this growing archive for sharing with the industry...
BTU Pyramax ‘Vacuum’ Installed in the APL

BTU Pyramax ‘Vacuum’ Installed in the APL

BTU International installed the first of its Pyramax Vacuum reflow oven product line in the APL for solder reflow studies to be shared with AREA consortium members. This oven operates like a standard convection reflow oven but includes an automated vacuum chamber in...
Electronic Upgrade for APL Thermal Rod Tester

Electronic Upgrade for APL Thermal Rod Tester

A unique APL thermal rod tester is routinely used to measure unit area thermal resistance and thermal conductivity of various thermal interface materials (TIMs) for AREA consortium members. Sample TIM bondlines of accurately controlled thickness are fabricated between...
Got Dirty Nozzles?

Got Dirty Nozzles?

One of the most critical steps to a robust SMT process is having clean nozzles. No SMT equipment can place components accurately and run efficiently without well-maintained nozzles. If the machine is either unable to pick parts consistently or hold on to the...