Sintering Copper Interconnects in Formic Acid

Sintering Copper Interconnects in Formic Acid

Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a...
Engaging the Electronics Assembly Community

Engaging the Electronics Assembly Community

AREA consortium assembly research is executed for the benefit of our member companies with all results and supporting data archived for on-demand access by the membership. Key observations are routinely selected from this growing archive for sharing with the industry...
Electronic Upgrade for APL Thermal Rod Tester

Electronic Upgrade for APL Thermal Rod Tester

A unique APL thermal rod tester is routinely used to measure unit area thermal resistance and thermal conductivity of various thermal interface materials (TIMs) for AREA consortium members. Sample TIM bondlines of accurately controlled thickness are fabricated between...