by Jeff Zopff | Apr 11, 2019 | APL News
Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a...
by Jeff Zopff | Apr 11, 2019 | APL News
AREA consortium assembly research is executed for the benefit of our member companies with all results and supporting data archived for on-demand access by the membership. Key observations are routinely selected from this growing archive for sharing with the industry...
by Jeff Zopff | Apr 11, 2019 | APL News
BTU International installed the first of its Pyramax Vacuum reflow oven product line in the APL for solder reflow studies to be shared with AREA consortium members. This oven operates like a standard convection reflow oven but includes an automated vacuum chamber in...
by Jeff Zopff | Apr 11, 2019 | APL News
A unique APL thermal rod tester is routinely used to measure unit area thermal resistance and thermal conductivity of various thermal interface materials (TIMs) for AREA consortium members. Sample TIM bondlines of accurately controlled thickness are fabricated between...
by Jeff Zopff | Apr 3, 2019 | Events
Visit Universal on Booth 1E27 Shanghai World Expo Exhibition and Convention Center Shanghai, China April 24–26, 2019 Official Show Site
