by Kristi Schilloff | Apr 19, 2022 | Blog
IGBT power modules (inverters) are needed to convert electricity from one form to another so that the electricity can be conveniently and safely used by many of the things we use in our everyday lives; including air conditioners, refrigerators, electric cars, and...
by Jeff Zopff | Mar 9, 2015 | Blog
[section background_repeat=”repeat” background_position=”center top” background_attachment=”static” background_scroll=”none”] March 9, 2015 – Universal Instruments’ proprietary Topside Alignment Placement (TAP)...
by Jeff Zopff | Jan 29, 2015 | Blog
[section background_repeat=”repeat” background_position=”center top” background_attachment=”static” background_scroll=”none”] January 29, 2015 – There are some inherent limitations of traditional low force method...
by Jeff Zopff | Jan 7, 2015 | Blog
[section background_repeat=”repeat” background_position=”center top” background_attachment=”static” background_scroll=”none”] January 6, 2015 – Imagine for example, combining active die components, WLCSPs, uBGAs...
by Jeff Zopff | Dec 3, 2014 | Blog
December 3, 2014 – Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly. New Package Functionality, Performance, Miniaturization, Low cost materials are...
