by Jeff Zopff | Sep 30, 2014 | Blog
September 30, 2014 – Component packaging is the single most important issue to take into account when considering automation for odd-form factor components. The electronics industry is pretty unique in that the majority of components are regulated by a...
by Jeff Zopff | Sep 25, 2014 | Blog
September 25, 2014 – The APL’s AREA Consortium will present four papers at the SMTAi technical conference. In session on Oct 1, Dr. Martin Anselm is going to talk about Component Warpage: Issues with Measurement and Standardization. In the Lead-Free Symposium on...
by Jeff Zopff | Sep 24, 2014 | Blog
September 24, 2014 – The latest-generation LEDs are a full-time obsession for our custom tooling experts. Not too long ago, we might receive a few LED nozzles and tooling requests each year… now, we receive hundreds. The advancement of LED technology has brought...
by Jeff Zopff | Sep 12, 2014 | Blog
September 12, 2014 – The LED came into existence in 1962 thanks to Mr. Nick Holonyak Jr. This is perfect timing considering the printed circuit was invented in 1958. LEDs have continued a solid advancement in “Technology Gains” and “where used” since then and...
by Jeff Zopff | Aug 19, 2014 | Blog
August 18, 2014 – Universal Instruments is going to hold a China market-focused seminar at NEPCON Shenzhen on August 26 & 27, in Rose Hall #2, 5th floor, Shenzhen Convention Center, and the Advanced Process Laboratory (APL) will present the precise and...
by Jeff Zopff | Aug 17, 2014 | Blog
August 17, 2014 – Universal Instruments’ Dr. Babak Arfaei is going to present “Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests” on August 25 at iNEMI Workshop on Board Assembly & Test Technology in Shenzhen,...
