Sintering Copper Interconnects in Formic Acid
APL prepares for next-generation flip chip assembly research with all copper interconnects.
Jeff Zopff
Author Archives
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Engaging the Electronics Assembly Community
Broad range of AREA Consortium research topics presented at the SMTA International conference in Rosemont, IL.
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BTU Pyramax ‘Vacuum’ Installed in the APL
The first BTU Pyramax Vacuum reflow oven is installed in the APL for detailed process capability studies on solder void reduction.
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Electronic Upgrade for APL Thermal Rod Tester
An electronics facelift improves the APL thermal interface measurement capability.
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NEPCON China 2019
Visit Universal on Booth 1E27 on April 24–26 to discuss your specific manufacturing challenges with our experts and discover how Universal can provide the perfect solution you’ve been waiting for.
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Huawei Chooses Universal to Automate Complex Server Assembly
Leading information and communications technology (ICT) infrastructure provider boosts productivity by more than 250%.
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Selcom Electronics Integrates Universal’s Fuzion for Automotive Application
Growing EMS replaces dedicated custom solution with flexible, high-performance platform.
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Universal Commemorates 100th Anniversary at IPC APEX
Leading-edge electronics assembly solutions provider celebrates milestone achievement.
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IPC APEX Expo 2019
Visit Universal on Booth 2308 on January 29–31 as we celebrate our 100th Anniversary! See demonstrations on some solutions from our comprehensive product portfolio talk with our experts to find out how you can streamline your production flow and maximize productivity.
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Universal Exhibits Complementary Automation Solutions at NEPCON
Versatile equipment portfolio poised to efficiently handle the most complex assembly challenges.