Inspur Chooses Universal’s FuzionOF for Challenging Odd-Form Automation
Leading infrastructure technology provider integrates ultra-flexible platform to address extreme assembly requirements.
Jeff Zopff
Author Archives
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SigmaPoint Adds Universal Fuzion Platform at New Advanced NPI Center
Canada-based EMS enhances rapid prototype/NPI capabilities at new Ontario facility.
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REDCOM EMS Installs Second Universal Instruments Fuzion Production Line
New solution expected to help triple production volumes, expand market opportunities for growing EMS.
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SMT Hautes Leverages Universal’s Fuzion for High-Volume Production in North America
Premiere EMS sets precedent for onshore volume production with addition of 400K cph high-speed line.
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Universal’s APL Shares AREA Consortium Research at SMTAi Technical Sessions
Industry-leading resource provides valuable insight for today’s most challenging electronics assembly processes.
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SMTA International 2019
Visit Universal on Booth 1215 on September 24–25 to discuss your current and next-generation technology challenges with Universal’s Advanced Process Lab (APL) experts. The APL will also present at multiple technical sessions during the four-day Conference taking place on September 22–26.
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APL Recognized by Cornell for Innovative Research
At the Annual MSE Awards Gala recently hosted by the Cornell University Materials Science Department our 2018 student intern was recognized for his innovative assembly research in the APL.
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Finetech Partners with AREA Consortium for Precision Assembly
Finetech partners with the AREA Consortium through the installation of a FINEPLACER® Pico bonding system in the Advanced Process Laboratory.
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The Advanced Process Lab Goes Back to School
APL interns from the Cornell University Materials Science program bring the lessons they have learned about electronic packaging assembly and reliability back the classroom to share with their classmates.
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The APL Cleans Up
An Electrovert Aquastorm 50 batch cleaner recently installed in the APL enables the use of water soluble solder paste formulations in your build requests.