Universal Celebrates Milestone 100th Anniversary
Electronics assembly pioneer hosts commemorative event to honor heritage.
Electronics assembly pioneer hosts commemorative event to honor heritage.
High-speed lines form foundation of new Poland facility, extend successful partnership.
Leading infrastructure technology provider integrates ultra-flexible platform to address extreme assembly requirements.
Canada-based EMS enhances rapid prototype/NPI capabilities at new Ontario facility.
New solution expected to help triple production volumes, expand market opportunities for growing EMS.
Premiere EMS sets precedent for onshore volume production with addition of 400K cph high-speed line.
Industry-leading resource provides valuable insight for today’s most challenging electronics assembly processes.
Visit Universal on Booth 1215 on September 24–25 to discuss your current and next-generation technology challenges with Universal’s Advanced Process Lab (APL) experts. The APL will also present at multiple technical sessions during the four-day Conference taking place on September 22–26.
At the Annual MSE Awards Gala recently hosted by the Cornell University Materials Science Department our 2018 student intern was recognized for his innovative assembly research in the APL.
Finetech partners with the AREA Consortium through the installation of a FINEPLACER® Pico bonding system in the Advanced Process Laboratory.