High-precision solutions for front and back-end processes drive smart factory efficiency

September 5, 2023 – Universal Instruments will join parent company Delta, a global leading provider of IoT-based Smart Green Solutions, to exhibit a comprehensive portfolio of smart solutions for semiconductor processing, including Delta’s Wafer Inspection and Grinding solutions and Universal’s Multi-die Advanced Packaging solutions. Universal will also demonstrate its FuzionSC™ Platform equipped with a High-Speed Wafer Feeder (HSWF) while Delta will highlight its Wafer Edge Grinding, Edge Profile Measurement, Sorter, and IR Pinhole Inspection capabilities. Visit us at Booth Q5446 (TaiNEX 2) at the SEMICON Taiwan trade show in Taipei on September 6–8.

The FuzionSC Platform delivers precision accuracy, the widest component range and the highest flip chip throughput across the largest area. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor space. The HSWF is the world’s fastest rapid-exchange multi-die feeder. Combined with FuzionSC, it provides the highest utilization and best overall economics for advanced multi-die applications.

“With multi-die packages burgeoning, we introduced a solution capable of placing multiple die types in a single cell and eliminated the need to move product between cells, which compromises both accuracy and efficiency,” said Universal Instruments Vice President of Marketing, Glenn Farris. “The flexibility, accuracy and throughput of this system make it the world’s only all-in-one solution for heterogeneous integration and leading-edge applications such as EV power module assembly. We’re thrilled to be able to showcase it alongside Delta’s breadth of precision processing solutions to the semiconductor community at the exhibition.”

Along with visiting the booth, Universal encourages attendees join one or both technical presentations by Glenn Farris, Universal Instruments Vice President of Marketing. On Wednesday, September 6 at 3:30 pm CST at FLEX Taiwan, he will present “Advanced Packaging Technology Enabling Wearable Electronics”. On Friday, September 8 at 2:40 pm CST, he will present “Intelligent System Architectures for Heterogeneous Integration Assembly” at the HITECH Smart Manufacturing Forum.

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.