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Industry Experts Gather at Universal Instruments for Joint Meeting

Industry Experts Gather at Universal Instruments for Joint Meeting

by Jeff Zopff | Nov 3, 2014 | Blog

November 3, 2014 – Universal Instruments’ AREA Consortium has linked meetings with the IPC PERM Council this time around to encourage synergistic research opportunities between the two organizations. PERM members that will participate in this joint meeting...
Pad Location Relative to Laminate Glass Weave Can Impact Strength and Fatigue Life of Pad

Pad Location Relative to Laminate Glass Weave Can Impact Strength and Fatigue Life of Pad

by Jeff Zopff | Oct 14, 2014 | Blog

October 14, 2014 – Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive). The pad is separated from the PCB, leaving a crater on...
4 Papers to Be Presented by Universal Instruments’ AREA Consortium at SMTAi

4 Papers to Be Presented by Universal Instruments’ AREA Consortium at SMTAi

by Jeff Zopff | Sep 25, 2014 | Blog

September 25, 2014 – The APL’s AREA Consortium will present four papers at the SMTAi technical conference. In session on Oct 1, Dr. Martin Anselm is going to talk about Component Warpage: Issues with Measurement and Standardization. In the Lead-Free Symposium on...
AREA Consortium – Developing Solutions for Tomorrow’s Electronics Assembly Challenges

AREA Consortium – Developing Solutions for Tomorrow’s Electronics Assembly Challenges

by Jeff Zopff | Jul 16, 2014 | Blog

July 16, 2014 – Advanced Research in Electronics Assembly (A.R.E.A) Consortium was initiated 22 years ago by Universal Instruments’ SMT Laboratory in the effort of conducting pre-competitive cooperative researches with Fortune 100 companies for the comprehensive...

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