by Jeff Zopff | Nov 3, 2014 | Blog
November 3, 2014 – Universal Instruments’ AREA Consortium has linked meetings with the IPC PERM Council this time around to encourage synergistic research opportunities between the two organizations. PERM members that will participate in this joint meeting...
by Jeff Zopff | Oct 14, 2014 | Blog
October 14, 2014 – Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive). The pad is separated from the PCB, leaving a crater on...
by Jeff Zopff | Sep 25, 2014 | Blog
September 25, 2014 – The APL’s AREA Consortium will present four papers at the SMTAi technical conference. In session on Oct 1, Dr. Martin Anselm is going to talk about Component Warpage: Issues with Measurement and Standardization. In the Lead-Free Symposium on...
by Jeff Zopff | Jul 16, 2014 | Blog
July 16, 2014 – Advanced Research in Electronics Assembly (A.R.E.A) Consortium was initiated 22 years ago by Universal Instruments’ SMT Laboratory in the effort of conducting pre-competitive cooperative researches with Fortune 100 companies for the comprehensive...
