August 18, 2014 – Universal Instruments is going to hold a China market-focused seminar at NEPCON Shenzhen on August 26 & 27, in Rose Hall #2, 5th floor, Shenzhen Convention Center, and the Advanced Process Laboratory (APL) will present the precise and...
August 17, 2014 – Universal Instruments’ Dr. Babak Arfaei is going to present “Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests” on August 25 at iNEMI Workshop on Board Assembly & Test Technology in Shenzhen,...
July 21, 2014 – The old saying ‘garbage in – garbage out’ can apply directly to this initial process in the assembly of SMT assemblies. Stencils designed without regard to materials, pad design and part geometry will create poor yields and needless rework....
Upcoming SMTA Webtorial on July 15th, 1:00pm to 2:30pm Eastern time: Failure Analysis – Lessons Learned in Manufacturing. Presented by Dr. Martin Anselm from Universal Instruments Corp. Click the link to...