by Jeff Zopff | May 21, 2015 | Blog, Blog, Blog, Blog
May 21, 2015 – The Advanced Process Laboratory of Universal Instruments may be the diamond in the tiara of the company. Operating as an independent business with labs in Binghamton, NY and Shanghai, China, the APL delivers several distinct offerings to its...
by Jeff Zopff | Mar 27, 2015 | Uncategorized
April 14, 2015 – The abstract of a paper recently presented at SMTA Dallas by Universal Instruments’ Advanced Process Lab. The trend in packaging technologies that enables faster, more effective data transfer, and processing is a continuous goal for the...
by Jeff Zopff | Aug 19, 2014 | Blog
August 18, 2014 – Universal Instruments is going to hold a China market-focused seminar at NEPCON Shenzhen on August 26 & 27, in Rose Hall #2, 5th floor, Shenzhen Convention Center, and the Advanced Process Laboratory (APL) will present the precise and...
by Jeff Zopff | Aug 17, 2014 | Uncategorized
August 17, 2014 – Universal Instruments’ Dr. Babak Arfaei is going to present “Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests” on August 25 at iNEMI Workshop on Board Assembly & Test Technology in Shenzhen,...
by Jeff Zopff | Jul 21, 2014 | Uncategorized
July 21, 2014 – The old saying ‘garbage in – garbage out’ can apply directly to this initial process in the assembly of SMT assemblies. Stencils designed without regard to materials, pad design and part geometry will create poor yields and needless rework....
