Next Generation PoP – Shrinking the Package-on-Package

Next Generation PoP – Shrinking the Package-on-Package

August 1, 2014 – It has been more than 5 years when the first generation of Package-on-Package came into form. The primary objective is to combine the memory and the application specific integrated circuit (ASIC) to use much lesser real property this shrinking...
New Way to Save on Universal Instruments’ Spare Parts

New Way to Save on Universal Instruments’ Spare Parts

July 18, 2014 – Starting this June, Universal Instruments rolled out a new way for customers to save on their spare parts and tooling purchases. Now, during the online checkout process, you can enter a promotional code to take advantage of regularly scheduled...
Universal Instruments’ New SMT Nozzle Cleaning Solution

Universal Instruments’ New SMT Nozzle Cleaning Solution

Using a poor SMT nozzle cleaning process or improper cleaning agent result in unsatisfactory pick and place performance, shorter nozzle lifespan and increased operating expense. Universal Instruments just launched our nozzle cleaning solution to ensure peak nozzle...