Universal Instruments Low Force Placement Solutions for Advanced Packaging
Low force method using LMR (Low Mass Redesign) spindle assemblies.
Blog
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The Anatomy of a Superior Placement Head
With so many placement head design concepts available, how do you tell which one is the best? The answer lies in the anatomy of the placement head. Whether it’s rotary, inline, small or large, each has its unique characteristics.
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How Through-Hole Technology is Helping the World Become Greener
CFL and LED lighting are helping to increase the demand for new radial through-hole equipment.
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Simplifying Complex NPI
Imagine for example, combining active die components, WLCSPs, uBGAs and passive SMDs with its interconnecting media such as solder paste and flux into a substrate. It will require series of processes that could consume certain length of time and multiple equipment utilization before it can be completed.
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New 0402 Long-Life Ceramic Nozzle
You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here’s why…
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Size Does Matter – Breaking the Barriers of Wafer Level Packaging
Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly. New package functionality, performance, miniaturization, low cost materials are driving the ever import Time to Market product life.
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Get the Machine on Your Team
In order to improve competitive position, manufacturers must first understand if they are getting the most out of their equipment set. The best way to do this is to first designate a production team to measure performance and understand where improvements are needed. But the question remains: “How do I assess my equipment performance?”
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Industry Experts Gather at Universal Instruments for Joint Meeting
Universal Instruments’ AREA Consortium has linked meetings with the IPC PERM Council this time around to encourage synergistic research opportunities between the two organizations.
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Universal Instruments Talked about Future Intelligent Manufacturing Opportunities
Universal Instruments shares market perspective with industry experts in Intelligent Manufacturing Industry Development Forum at CEIA Tianjin, China.
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Are Your SMT Machines ESD-Safe?
There is no such thing as an ESD-safe machine without an ESD-safe nozzle.
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Why Through-Hole Technology is Still Thriving in a High-Tech World
Through-hole technology is still alive and has a very important place in our current high-technology world. There are many uses for through-hole components in our ever-shrinking electronics landscape.
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Pad Location Relative to Laminate Glass Weave Can Impact Strength and Fatigue Life of Pad
Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive).