High-powered innovations facilitate efficient volume production for fast-growing markets.

April 19, 2016 – Universal Instruments will highlight two new high-volume production solutions on Channel Partner Gentron’s Booth B-1J35 at the 2016 NEPCON China trade show to be held at the Shanghai World Expo Exhibition & Convention Center on April 26–28. Recently launched at the IPC APEX EXPO in the U.S. and making its inaugural appearance in the China Market, Universal’s Flexbond™ is the first automated high-volume hot bar bonding platform. Also on the booth will be the company’s FuzionOF™ Platform configured with the new automated DIMM Socket Feeder, providing high-speed DIMM feeding directly from original vacuum formed tray packaging.

“We continue to invest and extend our solutions portfolio to align with market demands and these two additions support that initiative,” said Universal Instruments Vice President of Marketing, Glenn Farris. “By engaging with upstream technology drivers, we’re able to strategically develop our roadmap and stay ahead of fast-evolving industry trends. Both of our newest innovations leverage the capabilities of our Fuzion® Platform to offer unique value in today’s most relevant markets and it’s a pleasure to share that with the electronics assembly community here at NEPCON.”

Flexbond enables the first fully automated volume solution for advanced flex circuit applications utilizing hot bar interconnects. It incorporates a highly parallel bond head architecture to deliver 1800 UPH and precision process controls to maximize yields. Flexbond combines with Fuzion for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.

Universal’s combination of FuzionOF and the new high-speed DIMM Socket Feeder delivers up to three times the output and yield of manual or alternative press-fit or pre-wave automation solutions. FuzionOF features up to 15 kg insertion force and all-pin vision inspection for optimal yields. The high-speed DIMM Socket Feeder delivers up to three separate part numbers simultaneously from OEM vacuum trays to minimize labor requirements and eliminate detrimental component handling. With an elevator capacity of up to 20 trays, production can run uninterrupted for up to eight hours.

Farris noted that early adopters of these solutions “have been able to dramatically improve efficiency, output and yield, enjoying great success.” He added, “Flexbond solutions are a powerful enabler for the Wearables, Mobile, Medical and Automotive markets. Our high-speed odd-form solutions are positioned to address the accelerated growth in the telecommunications and networking infrastructure segments. Here in China, this is most evident in the emergence of large data centers supporting e-commerce and social media.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.