Pb-free research results shared with peers at May 27 event.

May 29, 2015 – Metallurgical observations from our alternate Pb-free solder evaluation program were shared with the CPMT electronic packaging community at the 65th Electronic Components & Technology Conference (ECTC) on May 27th. AREA staff Babak Arfaei presented the following paper:

Failure Mechanism and Microstructural Evolution of Pb-free Solder Alloys in Thermal Cycling Tests: Effect of Solder Composition and Sn Grain Morphology

The work was co-authored by key collaborators from Alcatel-Lucent (R. Coyle) and Binghamton University (F. Mutuku, E. Cotts). For a copy of the manuscript, contact babak.arfaei@uic.com.