The APL hosted the first AREA Consortium meeting of 2015 on March 25–26 on the Binghamton University research campus.

April 1, 2015 – The meeting was well attended with nearly all member companies represented. Agenda topics included a full array of board level interconnect research, including reliability studies of alternate lead free solder alloys, various underfill materials and conformal coatings. One session focused on the characterization and consequences of temperature induced package and board warpage—a common packaging industry challenge.  The copper pillar interconnect reliability project was introduced for the first time.  This project represents the consortium’s initial venture into the fast growing field of 2.5D and 3D semiconductor packaging.   Corning, the supplier of the glass interposers for this 2.5D packaging project, was in attendance to provide background for this promising new technology.

The full meeting technical content is available to the members in the Consortium Member Tools link.