CEIA Tianjin 2014

CEIA Tianjin 2014

CEIA Tainjin 2014 Tianjin Binhai International Convention & Exhibition Center Presentation: SMT Process Controls and Solutions October 22nd, 11:30am–12:00pm Booth 7-C20, Electronics Manufacturing Technology Forum...
Odd-Form Assembly Automation – Lead-to-Hole Ratio

Odd-Form Assembly Automation – Lead-to-Hole Ratio

October 6, 2014 – Lead-to-hole ratio is the amount of variance between the largest diameter/diagonal of the lead to the smallest diameter of the hole. This factor has to be considered in the determination of viability for automation. There are so many factors...