- John E. Pomeroy assumes temporary presidency and CEO of both Universal & Dover Technologies Inc.
- Gerhard Meese becomes Universal’s seventh President, drives significant growth at the company
- Universal receives patent for “Advanced Digital Motion Control,” allowing multiple acceleration, deceleration, and velocity rates for Surface Mount placement.
- SMT/TAB Bonder with the first application of platform concept shipped to Apple Computer.
- GSM1™ machine produced and shipped to Motorola, TX who chooses platform for their advanced manufacturing technologies; GSM1 acceptance proven by installation at 33 customer sites.
- GSM2™, dual beam configuration and Dual Head 8 family of Insertion Mount equipment is launched
- APAS Division ships first GSMxs™ high-accuracy placement machine to Hewlett Packard, Fort Collins, CO.
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John Pomeroy assumes presidency of Universal after the resignation of John Peebles.
Gerhard Meese becomes Universal’s seventh President
First Sanyo Chip Shooter remarketed as Universal equipment. The 4782 HSP provides topside and bottom side applications into solder paste or adhesives.
First Hot Bar Soldering-equipped machine with Boardflo® features for fine pitch assembly installed at NCR, SC.
1st SMT/TAB Bonder shipped to Apple Computer
OFS1 provides flexibility to insert through hole and mechanical components without tooling changes. The first Odd-Form System (OFS1) was completed; shipped to Turkey.
Universal receives ISO 9001 registration.
Introduction of the GSM1 platform used for high volume and high-mix manufacturing.
GSM2 platform was capable of placing different components simultaneously.
GSM platform wins Milton S. Kiver Grand Award for best-in-class product across the spectrum of electronics production equipment and materials.
Image of Dual Head Jumper Wire Inserter.
Universal introduces the new Flex Jet head for the GSM platform, offering high-speed placement for a wide range of components.
GSM1xs enables high volume production of flip chip assemblies through a combination of a multiple-spindle head, gang picking and gang dipping.
A couple additional points in history:
- Universal, IBM and General Electric fund electronic packaging research at T.J. Watson School of Engineering at SUNY Binghamton. Integrated Electronics Engineering Center (IEEC) is christened.
- Placement Machine Characterization Summit held with IPC who later adopts Universal methodology for its industry-wide standard.
- Phil Ragard, 44-year employee (34 patents) and Al Zemek, 30-year employee (33 patents), are honored in ceremonies
- Universal acquires Dynapert Through Hole assembly machine business & Alphasem, a leading Swiss manufacturer of semiconductor equipment
- Company honors retired Chairman J. Donald Ahearn by renaming the Frederick Street building in his name
- Universal acquires Conklin South in the Broome Corporate Park to support future growth in a cost-effective and flexible manner