AREA consortium assembly research is executed for the benefit of our member companies with all results and supporting data archived for on-demand access by the membership. Key observations are routinely selected from this growing archive for sharing with the industry...
BTU International installed the first of its Pyramax Vacuum reflow oven product line in the APL for solder reflow studies to be shared with AREA consortium members. This oven operates like a standard convection reflow oven but includes an automated vacuum chamber in...
A unique APL thermal rod tester is routinely used to measure unit area thermal resistance and thermal conductivity of various thermal interface materials (TIMs) for AREA consortium members. Sample TIM bondlines of accurately controlled thickness are fabricated between...
The APL’s new custom developmental laser selective reflow soldering tool performs localized solder reflow through the controlled impingement of a 980nm (IR) laser. Custom beam shaper optics redistribute the Gaussian spot beam to a user selected, uniform...
Innovative processes empowering the future of flexible substrates in electronics products. November 1, 2017 – Universal Instruments’ Advanced Process Lab (APL) will present a technical session entitled Joining to Temperature Sensitive Substrates with Asymmetric...
Complementary technology and process solutions provide foundation for lasting profitability. September 21, 2016 – Universal Instruments will exhibit on Booth #807 at the SMTA International 2016 Exhibition in Rosemont, IL, on September 27–28, demonstrating its...
