Sintering Copper Interconnects in Formic Acid
APL prepares for next-generation flip chip assembly research with all copper interconnects.
April 2019
Monthly Archives
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Engaging the Electronics Assembly Community
Broad range of AREA Consortium research topics presented at the SMTA International conference in Rosemont, IL.
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BTU Pyramax ‘Vacuum’ Installed in the APL
The first BTU Pyramax Vacuum reflow oven is installed in the APL for detailed process capability studies on solder void reduction.
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Electronic Upgrade for APL Thermal Rod Tester
An electronics facelift improves the APL thermal interface measurement capability.
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Got Dirty Nozzles?
One of the most critical steps to a robust SMT process is having clean nozzles. . . .
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NEPCON China 2019
Visit Universal on Booth 1E27 on April 24–26 to discuss your specific manufacturing challenges with our experts and discover how Universal can provide the perfect solution you’ve been waiting for.