Universal Introduces High-Volume Hot Bar and DIMM Solutions to China Market at NEPCON
High-powered innovations facilitate efficient volume production for fast-growing markets.
April 2016
Monthly Archives
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SMT Hybrid Packaging 2016
Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.
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NEPCON China 2016
Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.
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Mack Technologies Chooses Universal Instruments’ Fuzion Platform
Award-winning EMS company adds capacity and doubles utilization while also enhancing technical capabilities and operational flexibility.