Universal’s tool and die talents were pressed to answer New York State’s small arms manufacturers’ demands for gauges and fixtures (such as Ithaca Gun, Buffalo Arms, and General Motors) Other defense contractors such as IBM, Bendix-Scintilla, Eclipse Machine, Remington Rand, and Link Aviation required customer tooling and machining.
Universal adds Brewer-Titchener and Wilkinson Manufacturing of Binghamton; Morse Chain and Allen Wales, Adding Machines of Ithaca, Scintilla Magneto of Sidney, and Smith Corona Typewriter of Syracuse and Groton to customer list.
Personnel and machine growth requires expansion; basement quarters are leased.
The Great Depression continues; Universal survives by cutting costs and investing in new equipment.
Universal engineers and IBM (Kingston) specialists devised a method of preparing axial lead components for IBM’s printed circuit board assembly. The “taping machine” was born and opened the door for Universal’s electronic component equipment era.
Company produces thousands of frames for modular plug in units used in the production of TVs.
President J. Donald Ahearn begins restructuring the company to capitalize on the burgeoning electronics industry.
Universal begins building component prepping equipment for component manufacturers across the country.
F.H. Lawson hired from Link Aviation; becomes Vice President and Board member.
Company purchases 36,000 square foot building and 10 acres at Bevier Street.
Licensed authorization of design features from IBM and United Shoe Machines’ Dynapert Division allows Universal to manufacture printed circuit board insertion equipment.
1st sale of Universal’s insertion equipment to Remington Rand Univac at Utica, NY credited to President Ahearn and Engineer, Phil Ragard.
Transistors replace vacuum tubes in IBM Computer circuitry. Universal asked to design and manufacture preparation equipment for these and other odd shaped components.
Universal’s first Sequencer—a machine to select random components from reels and respool insertion sequence is introduced; sold to Western Electric, Chicago.
Second addition to Bevier Street adds 18,000 sq. ft. for machinery expansion
J.D. Ahearn becomes Chairman of the Board; F.H. Lawson becomes Company’s third President & employment hits 339
Radial Lead Component Sequencer/Inserter product line introduced; well received by customers.
Universal and Sanyo Electric, Japan enter “strategic partnership” with reciprocal exchange of machines to strengthen our position in surface mount market.
Surface Mount product line gets two new additions; entry level Omniplace® Flexible Placement and Ultraplace® High Speed Chip Placement machines.
Universal’s Advanced Process Lab (APL), founded by George Westby, is createdto help Universal’s customers optimize their SMT processes.
MEA’s 17-year association ends as that division separates to become Dover Electronics Manufacturing (DEM), a subsidiary of Dover Technologies.
F.H. Lawson retires, ends 27-year service record. John Peebles elected as sixth Universal President.
General business recession hits electronics industry; downturn in orders begins.
John E. Pomeroy assumes temporary presidency and CEO of both Universal & Dover Technologies Inc.
Gerhard Meese becomes Universal’s seventh President, drives significant growth at the company
Universal receives patent for “Advanced Digital Motion Control,” allowing multiple acceleration, deceleration, and velocity rates for Surface Mount placement.
SMT/TAB Bonder with the first application of platform concept shipped to Apple Computer.
GSM1™ machine produced and shipped to Motorola, TX who chooses platform for their advanced manufacturing technologies; GSM1 acceptance proven by installation at 33 customer sites.
GSM2™, dual beam configuration and Dual Head 8 family of Insertion Mount equipment is launched
APAS Division ships first GSMxs™ high-accuracy placement machine to Hewlett Packard, Fort Collins, CO.
The revolutionary Lightning™ Head is introduced. This 30-spindle high-speed chip placement head strengthens Universal’s position in the mid-range and high-speed flexible market.
Key products introduced:
The release of the HSP 4797 launches company into the high-speed chip placement market.
GSM Genesis™ platform is released as the next generation dual-beam platform.
Single-beam AdVantis™ platform is introduced to address the mid-range market.
Introduction of Polaris Jr. complements the existing Polaris Multi-process assembly cell.
Quadris™, a quad-beam SMT placement system, hits the high-speed market.
Dimensions™ Manufacturing software; a leading-edge factory automation software to optimize efficiency and productivity, is launched.
Jean-Luc Pelissier takes the reins to become Universal’s eleventh (and current) President & CEO.
With our strong core product portfolio and stellar industry expertise, company transitions into a provider of comprehensive line solutions
Lightning™ Head upgraded and renamed as FZ30™; provides significant improvements in accuracy & reliability
Continuous investment in R & D leads to significant product launches, including:
Flagship Fuzion® Platform family launched, providing the industry’s highest utilization and versatility
Launch of Uflex™; a revolutionary new flexible automation platform enables a full range of custom processes on a standard cell to maximize re-configurability and minimize time to market
Flexbond™ launch secures Universal position in the hot-bar bonding market
FuzionSC™ delivers accuracy and throughput over the largest work area for today’s advanced packaging applications
Universal’s APL helps their customer develop a high yield medical device (heart catheter) and bring it to market with material selection, design and process development
Since our founding in 1919, Universal has been dedicated to embracing technology and innovation to enable our customers’ success.
We are actively engaged in strategic partnerships with some of the world’s largest industry innovators at the forefront of their markets; Automotive, Consumer, Infrastructure, Mobile and more. . .
We offer the broadest equipment range in the industry; – Surface Mount, Insertion Mount, Advanced Packaging, Automation, Component and Die Handling Solutions; 25,000+ systems installed globally.
Our proud engineering heritage drives our continuous investment in R&D leading to 370+ patents.
We have a strong global infrastructure: offices throughout US, Europe, Asia & SEA, filled with a diverse and talented team from a variety of backgrounds.
As our second century dawns, we’re ready. We will continue to build upon our proud heritage of engineering and disruptive innovation to drive the future of the electronics industry, and to deliver products that inspire our customers to build better!