Universal Highlights Advanced Package-on-Package at SEMICON Taiwan
Presentation to examine process optimization for wide IO Package-on-Package implementation
August 2013
Monthly Archives
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GLOBALFOUNDRIES VP to Speak at Universal’s APL Consortium Reunion
Industry expert David McCann, vice president, Packaging and R&D, GLOBALFOUNDRIES, will present keynote address at technology-sharing event.
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Microtronix Boosts Productivity with Universal’s Advantis and Genesis
Leading contract manufacturer in South Africa triples output using Universal Instruments’ surface mount and odd-form solutions.