
Universal Highlights Advanced Package-on-Package at SEMICON Taiwan
Presentation to examine process optimization for wide IO Package-on-Package implementation
Presentation to examine process optimization for wide IO Package-on-Package implementation
Industry expert David McCann, vice president, Packaging and R&D, GLOBALFOUNDRIES, will present keynote address at technology-sharing event.
Leading contract manufacturer in South Africa triples output using Universal Instruments’ surface mount and odd-form solutions.