Unique architecture enables the first true volume solution for today’s consumer demands.

October 11, 2016 – Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT & Packaging Global Technology Award at the 2016 SMTA International trade show in Chicago, IL as the top machine in the “Bonding Equipment” category. Winners were selected by an independent, international panel and evaluations for the award entries were based on innovation, speed/throughput improvements, quality, cost benefits, environmental considerations, ease of use/implementation, and maintainability.

Flexbond is a dynamic, high-throughput hot bar bonding platform that enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines with Universal Instruments’ Fuzion® Platform for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.

These configurable solutions have been shown to provide up to 12X the throughput of semi-automated solutions and more than twice that of alternative automated hot bar solutions. They also require significantly fewer machines and offer the lowest OPEX and $/cph/m2.

Flexbond leverages dual-zone parallel processing with up to 12 bond heads – 4X alternative solutions – to deliver industry-best performance and a maximum bonding rate of 1800 UPH. It also incorporates advanced hot bar technologies to give the user complete process control. Programmable, closed-loop temperature control ensures alignment with soldering thermal profiles and maintains precise, consistent performance. For pressure control, Flexbond features programmable settings and high-accuracy pressure management to prevent solder shorts and maintain solder shape.

“Advanced flex circuits are a key technology driving the next generation of wearables, mobile devices and other leading-edge products. Unlike traditional hot bar solutions, Flexbond gives manufacturers a high-performance solution to meet the volume assembly requirements for these growing markets,” said Universal Instruments Vice President of Marketing, Glenn Farris. “We continue to expand our solutions portfolio into the markets and applications we see as defining the future of the industry. We’re very proud to have received this award, as it confirms that we’ve given our customers the right tool to maintain a competitive advantage and win.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.

Flexbond独特的框架设计,令它成为业内首个全自动高产量热 压焊接机。

中国上海,2016年10月10日 – 环球仪器日前宣布,旗下新推出的FlexbondTM热压焊接机,在美国芝加哥举行的SMTA国际展2016中,获得环球SMT与封装杂志颁发的环球科技奖,在“邦定设备”中脱颖而出。

该项大奖的评审团由一群独立的国际专家组成,评审标准包括:设备的创新性、可提升的速度/产出的程度、质量、成本效益、环保、使用/操作的容易性,与及设备的可维护性。

FlexbondTM是一款灵动、高产量的热压焊接机,可整合成为一个全自动的高产量生产方案,应对先进柔板与其他热压焊接互连应用。它若配合环球仪器Fuzion®平台使用,可以整合所有工艺流程,包括助焊剂转移、高精准度的贴装与及热压焊接。

这部可按生产需要设置的平台,产量最高为半自动生产方案的12倍,为其他全自动替代生产方案的两倍以上,大大减少购置机器的数量,实现最低的$/cph/m2及最低的营运成本。

Flexbond采用双模块平行操作,配备最多达12个焊接头,提供四套不同解决方案,令它成为业内性能表现最佳的平台,最高焊接速度达1800 UPH。它所使用的先进热压技术,让厂家可以完全操控整个工艺流程。

Flexbond配备的闭环温度控制,确保温度与焊接温度曲线完全保持一致,确保精准及稳定的性能表现。在压力控制方面,Flexbond带有可编程的装置,加上其高精准的压力管理,防止出现焊料缺陷的情况,以保持焊料形状。

“先进的柔性电路板是推动下一代可穿戴式电子产品、移动设备以及其他尖端科技产品的重要一环。Flexbond有别于传统的热压焊接方案,它给厂家提供一个高性能的平台,可以应对这些新兴及极具增长潜力市场及应用的大批量组装需求。”环球仪器市场副总裁Glenn Farris称。

“我们将继续对会行业未来发展方向的市场及应用,开拓解决平台组合。对于这次能获得环球科技术奖,我们深感荣幸,因为它表示我们的确为客户提供了最佳的工具,令他们始终保持竞争优势,并且稳操胜券。”他续称。

如欲多了解环球仪器方案如何应对电子生产挑战的话,可以致电0755-2685-9108或021-6495-2100,或浏览www.uic.com,查询详情。

Unique architecture enables the first true volume solution for today’s consumer demands.

October 11, 2016 – Universal Instruments’ Flexbond™ hot bar bonding platform was presented the Global SMT & Packaging Global Technology Award at the 2016 SMTA International trade show in Chicago, IL as the top machine in the “Bonding Equipment” category. Winners were selected by an independent, international panel and evaluations for the award entries were based on innovation, speed/throughput improvements, quality, cost benefits, environmental considerations, ease of use/implementation, and maintainability.

Flexbond is a dynamic, high-throughput hot bar bonding platform that enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines with Universal Instruments’ Fuzion® Platform for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.

These configurable solutions have been shown to provide up to 12X the throughput of semi-automated solutions and more than twice that of alternative automated hot bar solutions. They also require significantly fewer machines and offer the lowest OPEX and $/cph/m2.

Flexbond leverages dual-zone parallel processing with up to 12 bond heads – 4X alternative solutions – to deliver industry-best performance and a maximum bonding rate of 1800 UPH. It also incorporates advanced hot bar technologies to give the user complete process control. Programmable, closed-loop temperature control ensures alignment with soldering thermal profiles and maintains precise, consistent performance. For pressure control, Flexbond features programmable settings and high-accuracy pressure management to prevent solder shorts and maintain solder shape.

“Advanced flex circuits are a key technology driving the next generation of wearables, mobile devices and other leading-edge products. Unlike traditional hot bar solutions, Flexbond gives manufacturers a high-performance solution to meet the volume assembly requirements for these growing markets,” said Universal Instruments Vice President of Marketing, Glenn Farris. “We continue to expand our solutions portfolio into the markets and applications we see as defining the future of the industry. We’re very proud to have received this award, as it confirms that we’ve given our customers the right tool to maintain a competitive advantage and win.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.