High-speed platform doubles output for memory module production, continues rewarding collaboration between companies.

March 30, 2016 – To meet the demands of a growing customer base, US-based Contract Electronics Manufacturer Silicon Mountain Contract Services (SMCS) has added a Fuzion4-120 high-speed platform to its Nampa, ID manufacturing facility. The new Fuzion® is the sixth Universal Instruments surface mount platform in the SMCS production portfolio and is being used initially for building memory modules. In honor of the successful ongoing relationship between the two companies, Universal presented SMCS with a Partnership Award at the 2016 IPC APEX EXPO held in Las Vegas earlier this month.

“When we bought our first Universal platform and implemented new process controls in 2009, our first pass yield improved by more than 98%,” said SMCS Principal Partner, Wayne Townsend. “That was the beginning of a formidable partnership that has helped us provide exceptional value to an increasingly diverse customer base. We have several Universal platforms performing exceedingly well across a variety of applications and we feel privileged to work together with a solutions provider that continues to facilitate our growth.”

The Fuzion4-120 Platform delivers throughputs up to 140,000 cph by utilizing four 30-spindle, high-speed FZ30 placement heads. Fuzion4-120 handles components from 01005 to 30 mm square while accommodating boards up to 700 mm x 500 mm.

Townsend highlighted the performance of the new platform, noting, “The Fuzion4-120 is building more than twice the product of the previous solution in a smaller footprint, which opens up our floor space for other opportunities. In addition, the defects for this challenging product have been reduced by 75% – just fantastic!”

“Working with Wayne and SMCS has been a pleasure and a perfect fit,” said Universal Instruments Vice President of Customer Operations, Brad Bennett. “We’ve been able to integrate a number of solutions to help SMCS evolve and stay ahead of its customers’ demands, and the Partnership Award stands as testament to our alliance and the high level of success we’ve achieved together.” He added, “Wayne has a uniquely personal approach to the way he does business and has even purchased more than one Fuzion right from our tradeshow booth!”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.

Silicon Mountain在添置环球仪器极高速的Fuzion贴片机后,其内存模块的产量立时翻倍,令两家公司继续保持互利互惠的合作关系,Silicon Mountain更获环球仪器颁发合作伙伴奖。

中国上海,2016年4月18日 – 美国Silicon Mountain公司为一家美国本土代工厂,为了应对日渐增加的客户群,为其美国厂房增添一台Fuzion4-120™高速贴片机,成为该公第六台环球仪器贴片机,主要用作生产内存模块。

环球仪器为了感谢Silicon Mountain的长期支持,在今年于拉斯维加斯举行的APEX 展会中,向Silicon Mountain颁赠合作伙伴奖。

“在2009年时,当我们第一次购买环球仪器贴片机,并同时引入全新生产流程工序控制后,我们的直通率提升了98%以上。” Silicon Mountain的首席合伙人Wayne Townsend称。“自此以后,我们与环球仪器开展了极为紧密的合作关系,令我们能应对各式各样要求不同的客户,为他们创造超卓的价值。我们拥有多台环球仪器贴片机,可应付各种不同应用,而我们也庆幸能与一家可以协助我们成长的解决方案供应商合作。”

Fuzion4-120贴片机的贴片速度高达140,000 cph,采用四个30轴的高速FZ30™贴装头。Fuzion4-120贴片机能贴装的元件范围为01005至30平方毫米,可以处理的电路板面积可达700毫米 X 500毫米。

Townsend在谈及Fuzion4-120贴片机的性能表现时,他指出:“以Fuzion4-120贴片机的占地面积计算,它比我们之前采用的贴片机还要小,但产量却是两倍以上,能为我们腾出空间来开展其他生产工序。此外,这部贴片机的坏件率,比前设备大大减少75%,实在令人惊讶!”

“环球仪器很高兴能与Townsend及Silicon Mountain合作,也深深感到我们的设备正好切合Silicon Mountain的发展需要。”环球仪器客户服务副总裁Brad Bennett续称:“我们成功地为Silicon Mountain设计多个生产解决方案,协助Silicon Mountain扩展,时刻保持领先客户需要的位置。”

“环球仪器向Silicon Mountain颁赠合作伙伴奖,正好说明双方的合作关系,与及双方共同创造的成功。” Bennett续指出:“Townsend的业务风格很独特,他曾经在参观我们的展位后,立时决定购买不止一部Fuzion贴片机。”

如欲多了解环球仪器方案如何应对电子生产挑战的话,可以致电0755-2685-9108或021-6495-2100,或浏览www.uic.com,查询详情。

High-speed platform doubles output for memory module production, continues rewarding collaboration between companies.

March 30, 2016 – To meet the demands of a growing customer base, US-based Contract Electronics Manufacturer Silicon Mountain Contract Services (SMCS) has added a Fuzion4-120 high-speed platform to its Nampa, ID manufacturing facility. The new Fuzion® is the sixth Universal Instruments surface mount platform in the SMCS production portfolio and is being used initially for building memory modules. In honor of the successful ongoing relationship between the two companies, Universal presented SMCS with a Partnership Award at the 2016 IPC APEX EXPO held in Las Vegas earlier this month.

“When we bought our first Universal platform and implemented new process controls in 2009, our first pass yield improved by more than 98%,” said SMCS Principal Partner, Wayne Townsend. “That was the beginning of a formidable partnership that has helped us provide exceptional value to an increasingly diverse customer base. We have several Universal platforms performing exceedingly well across a variety of applications and we feel privileged to work together with a solutions provider that continues to facilitate our growth.”

The Fuzion4-120 Platform delivers throughputs up to 140,000 cph by utilizing four 30-spindle, high-speed FZ30 placement heads. Fuzion4-120 handles components from 01005 to 30 mm square while accommodating boards up to 700 mm x 500 mm.

Townsend highlighted the performance of the new platform, noting, “The Fuzion4-120 is building more than twice the product of the previous solution in a smaller footprint, which opens up our floor space for other opportunities. In addition, the defects for this challenging product have been reduced by 75% – just fantastic!”

“Working with Wayne and SMCS has been a pleasure and a perfect fit,” said Universal Instruments Vice President of Customer Operations, Brad Bennett. “We’ve been able to integrate a number of solutions to help SMCS evolve and stay ahead of its customers’ demands, and the Partnership Award stands as testament to our alliance and the high level of success we’ve achieved together.” He added, “Wayne has a uniquely personal approach to the way he does business and has even purchased more than one Fuzion right from our tradeshow booth!”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.