Fast and Local – Reflow Where You Need It

The APL’s new custom developmental laser selective reflow soldering tool performs localized solder reflow through the controlled impingement of a 980nm (IR) laser. Custom beam shaper optics redistribute the Gaussian spot beam to a user selected, uniform rectangular area beam. This selectable incident area ranges from 4x4mm to 100×200 mm. Beam power is controlled from 50 to 2000W. We will be exploring process capabilities of this technology within the 2017 consortium research portfolio. The tool is however also available for product specific assembly trials by our customer community. Suggestions for novel joining materials or processes enabled by this technology are welcome.

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