Visit Universal on Booth #807 on September 27–28 and see how our solutions experts can help with your specific production challenges.

Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.

Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.

Visit Universal on Booth 2441 at the 2016 IPC APEX EXPO 2016 on March 15–17 and see two pioneering additions to the industry’s most comprehensive solutions portfolio: the Uflex™ modular automation platform and the Flexbond™ hot bar bonding platform.

Visit Universal on Channel Partner Sigmatek’s Booth# 1531 at SEMICON Shanghai 2016 on March 15–17 and learn how Universal’s team of solutions experts can help solve your manufacturing challenges.

Join Universal’s Advanced Process Lab (APL) experts at the SMTA Dallas Expo & Tech Forum on March 3, 2016 and learn how Universal can help you realize rapid product introduction, maximize yield and optimize reliability.

Join Universal’s Advanced Process Lab (APL) experts at the SMTA Houston Expo & Tech Forum on March 1, 2016 and learn how Universal can help you realize rapid product introduction, maximize yield and optimize reliability.

Universal Instruments’ Advanced Process Lab will deliver a technical presentation entitled “Catheter Process Development” at 11:30–12:15pm at the SMTA Rocky Mountain Expo & Tech Forum on January 26, 2016. Join our APL experts and learn how Universal can help you realize rapid product introduction, maximize yield and optimize reliability.

Universal Instruments will feature both high-speed and ultra-flexible variants of its award-winning Fuzion® Platform, as well as the cost-effective automation of the Polaris Assembly Cell at Productronica 2015. Join the Universal team on Hall A2, Booth 459 and learn more about Universal’s innovative surface mount, odd-form and automation solutions.

Universal Instruments will highlight its unique, leading-edge advanced packaging solutions and expertise on Booth #32 at IWPLC 2015. Visit our experts on the booth and see how Universal can position you for success with your next advanced packaging challenge.

Join Universal on Booth #306 for a demonstration of the versatile performance of the Fuzion2-60™ Platform. Attend Universal’s LF1 Session (October 1) entitled: “Universal Instruments Consortium Pb-Free Project Update” for an update on the AREA Consortium’s ongoing research on lead-free technology and, in particular, its effects on long-term reliability.

Attend the Track 1 Session (September 17) paper presented by Universal Instruments and learn how Universal’s APL developed a robust assembly solution that enabled high-volume production of advanced medical device at nearly 100% yields.