Visit Universal on Booth 3141 on February 27 – March 3 and let our experts show how you can maximize efficiency and build better.

Visit Universal at the MEPTEC 2018 New Generation Flexible Hybrid Electronics Symposium on April 26 to learn about the leading-edge solutions we offer for current and future FHE challenges. Some of our core competencies include: flex circuit and thin film handling, high-accuracy thin die and passive placement, and ultra-fine pitch placement. Join us at the event to learn more!

Visit Universal on Booth 3141 on February 27 – March 3 and let our experts show how you can maximize efficiency and build better.

Visit Universal on Booth 223 on September 19–20 and let our experts show how you can automate your success and optimize your manufacturing operations.

Visit Universal on Booth 223 on September 19–20 and let our experts show how you can automate your success and optimize your manufacturing operations.

Visit Universal on Booth IN65 on August 29–31 and let our experts show you how our leading-edge technology building blocks can help you integrate the ultimate solution for your unique production challenges.

Visit Universal on Hall 4-101 on May 16–18 and let our solutions experts help you optimize productivity for your greatest packaging and production challenges.

Visit Universal on Booth #827 on February 14–16 to see our latest technology innovations and discuss your specific production challenges with our solutions experts.

Visit Universal on Booth #807 on September 27–28 and see how our solutions experts can help with your specific production challenges.

Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.

Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.

Visit Universal on Booth 2441 at the 2016 IPC APEX EXPO 2016 on March 15–17 and see two pioneering additions to the industry’s most comprehensive solutions portfolio: the Uflex™ modular automation platform and the Flexbond™ hot bar bonding platform.