1990s

    • John E. Pomeroy assumes temporary presidency and CEO of both Universal & Dover Technologies Inc.
    • Gerhard Meese becomes Universal’s seventh President, drives significant growth at the company
    • Universal receives patent for “Advanced Digital Motion Control,” allowing multiple acceleration, deceleration, and velocity rates for Surface Mount placement.
    • SMT/TAB Bonder with the first application of platform concept shipped to Apple Computer.
    • GSM1™ machine produced and shipped to Motorola, TX who chooses platform for their advanced manufacturing technologies; GSM1 acceptance proven by installation at 33 customer sites.
    • GSM2™, dual beam configuration and Dual Head 8 family of Insertion Mount equipment is launched
    • APAS Division ships first GSMxs™ high-accuracy placement machine to Hewlett Packard, Fort Collins, CO.
  • John Pomeroy assumes presidency of Universal after the resignation of John Peebles.

  • Gerhard Meese becomes Universal’s seventh President

  • First Sanyo Chip Shooter remarketed as Universal equipment. The 4782 HSP provides topside and bottom side applications into solder paste or adhesives.

  • First Hot Bar Soldering-equipped machine with Boardflo® features for fine pitch assembly installed at NCR, SC.

  • 1st SMT/TAB Bonder shipped to Apple Computer

  • OFS1 provides flexibility to insert through hole and mechanical components without tooling changes. The first Odd-Form System (OFS1) was completed; shipped to Turkey.

  • Universal receives ISO 9001 registration.

  • Introduction of the GSM1 platform used for high volume and high-mix manufacturing.

  • GSM2 platform was capable of placing different components simultaneously.

  • GSM platform wins Milton S. Kiver Grand Award for best-in-class product across the spectrum of electronics production equipment and materials.

  • Image of Dual Head Jumper Wire Inserter.

  • Universal introduces the new Flex Jet head for the GSM platform, offering high-speed placement for a wide range of components.

  • GSM1xs enables high volume production of flip chip assemblies through a combination of a multiple-spindle head, gang picking and gang dipping.

  • A couple additional points in history:

    • Universal, IBM and General Electric fund electronic packaging research at T.J. Watson School of Engineering at SUNY Binghamton. Integrated Electronics Engineering Center (IEEC) is christened.
    • Placement Machine Characterization Summit held with IPC who later adopts Universal methodology for its industry-wide standard.
    • Phil Ragard, 44-year employee (34 patents) and Al Zemek, 30-year employee (33 patents), are honored in ceremonies
    • Universal acquires Dynapert Through Hole assembly machine business & Alphasem, a leading Swiss manufacturer of semiconductor equipment
    • Company honors retired Chairman J. Donald Ahearn by renaming the Frederick Street building in his name
    • Universal acquires Conklin South in the Broome Corporate Park to support future growth in a cost-effective and flexible manner