In April 2025, I took my first e-Learning course: Surface Mount Operator Suite. I have no formal education in precision automation solutions for the semiconductor and electronics manufacturing industry. With this being said, I was unsure if I’d be able to comprehend the course material, much less keep up with it. After diving in and now completing the course, I can honestly say it is suitable for anyone with the capacity to learn, and it is more user-friendly than I could’ve anticipated.

As Moore’s Law slows, Heterogeneous Integration (H.I.) is emerging as the smarter path forward—combining multiple specialized dies (logic, memory, RF, power) into one compact, high-performance package. This blog explores how H.I. is transforming everything from smartphones to datacenters, and how advanced platforms like FuzionSC™ + High-Speed Wafer Feeder are simplifying complex multi-die assembly. The result? Faster development, lower costs, and better chips—built for the future.