As Moore’s Law slows, Heterogeneous Integration (H.I.) is emerging as the smarter path forward—combining multiple specialized dies (logic, memory, RF, power) into one compact, high-performance package. This blog explores how H.I. is transforming everything from smartphones to datacenters, and how advanced platforms like FuzionSC™ + High-Speed Wafer Feeder are simplifying complex multi-die assembly. The result? Faster development, lower costs, and better chips—built for the future.

Traditional inspection methods fall short when it comes to next-gen “fish-eyed” press-fit pins—whose flared, asymmetrical geometry makes them nearly impossible to evaluate with 2D vision systems. One misaligned pin on a $15K board can mean catastrophic failure down the line. That’s why we’ve implemented precision 3D laser inspection across our platforms—combining upward and downward vision, sub-micron accuracy, and custom tooling to catch defects in real time and ensure flawless placement the first time, every time.

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Get 30% off a limited number of SELECT spare parts for your Universal equipment, covering our entire range from surface-mount to insertion-mount. Ensure peak performance with genuine Universal Spare Parts, designed and quality tested for the highest standards.

Learn about how Suzanne in her role as Total Quality Project Manager helps to ensure quality is at the forefront of what we do.

Learn about how purchasing genuine Universal spare parts can help you get the most out of your service dollar spend, and ensure optimal performance for all of your capital equipment.

Learn about how becoming a member of Universal’s A.R.E.A. Consortium can help you build your products better and faster with access to collaborative research and information on how to best utilize the latest materials and processes, or solve today’s industry challenges.

Learn about why we are supporting the American Semiconductor Innovation Coalition

Learn about how training for the modern world can help to increase your team’s effectiveness and increase your bottom line . . . .