Advanced Process Lab Webinar

November 2, 2020

Join us on November 12 for a FREE webinar:

Tools, Tech. & Knowledge to Solve today’s Complex Manufacturing Problems



  • Multiple global time-zone friendly sessions available (@ 9 am,  2 pm & 8:00 pm EDT), click HERE to sign up!

  • Chance to WIN an Amazon or VISA Gift Card; test your trivia knowledge and more. . .

  • Learn about the tips and tricks of how to adapt your processes to fix a bad stencil design


Hosted by Dave Vicari, Director, APL – a scientist (and world-class angler) with 30+ years of broad-based experience in solving the challenges faced by the electronics industry!


At this webinar, you’ll learn about:

  • How the APL can help YOU Build your Best!

  • How to fix a broken product or process


  • Ways to build a new product or build it better and faster

  • How to meet ramp and/or small lot prototype requirements


  • How to access today’s newest manufacturing processes 

  • How the APL brought a product to market and fixed a broken heart


Would you like to build better, faster & smarter or are you interested in learning more about the APL, then sign up below. 

  • Click HERE to sign up for this FREE webinar!


We look forward to seeing you on November 12th.


The APL delivers the  knowledge
to help you build better, faster & smarter!

Check out all that the APL has to offer here!

 


More Related Posts

Important Update on Spare Parts Payment Options

Payment options for spare parts are changing after March 31, 2026. After that time we will no longer be accepting credit cards.

The Agile Learner: An Ode to e-Learning

In April 2025, I took my first e-Learning course: Surface Mount Operator Suite. I have no formal education in precision automation solutions for the semiconductor and electronics manufacturing industry. With this being said, I was unsure if I’d be able to comprehend the course material, much less keep up with it. After diving in and now completing the course, I can honestly say it is suitable for anyone with the capacity to learn, and it is more user-friendly than I could’ve anticipated.

“Moore” Is Better with Heterogeneous Integration

As Moore’s Law slows, Heterogeneous Integration (H.I.) is emerging as the smarter path forward—combining multiple specialized dies (logic, memory, RF, power) into one compact, high-performance package. This blog explores how H.I. is transforming everything from smartphones to datacenters, and how advanced platforms like FuzionSC™ + High-Speed Wafer Feeder are simplifying complex multi-die assembly. The result? Faster development, lower costs, and better chips—built for the future.