Keep track of Universal’s technology tour as we navigate a challenging environment for sharing knowledge with our colleagues and customers. We’ll be using every available platform to let you know what’s new and exciting at Universal. Watch out for our virtual and live trade show schedule.
Visit Universal on Booth IN65 on August 29–31 and let our experts show you how our leading-edge technology building blocks can help you integrate the ultimate solution for your unique production challenges.
Visit Universal on Hall 4-101 on May 16–18 and let our solutions experts help you optimize productivity for your greatest packaging and production challenges.
Visit Universal on Booth #827 on February 14–16 to see our latest technology innovations and discuss your specific production challenges with our solutions experts.
Visit Universal on Booth #807 on September 27–28 and see how our solutions experts can help with your specific production challenges.
Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.
Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.
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