UPCOMING

EVENTS

Keep track of Universal’s technology tour as we navigate a challenging environment for sharing knowledge with our colleagues and customers. We’ll be using every available platform to let you know what’s new and exciting at Universal. Watch out for our virtual and live trade show schedule.

IPC APEX Expo 2020
IPC APEX Expo 2020

Visit Universal on Booth 1837 on February 4-6 to see demonstrations on our IQ360™ Factory Software Suite machine-to-machine process controls and learn how our flexible assembly platforms combined with our integrated end-to-end smart factory solutions can streamline your production flow and drive operational excellence into your factory.

SMTA International 2019
SMTA International 2019

Visit Universal on Booth 1215 on September 24–25 to discuss your current and next-generation technology challenges with Universal’s Advanced Process Lab (APL) experts. The APL will also present at multiple technical sessions during the four-day Conference taking place on September 22–26.

NEPCON China 2019
NEPCON China 2019

Visit Universal on Booth 1E27 on April 24–26 to discuss your specific manufacturing challenges with our experts and discover how Universal can provide the perfect solution you’ve been waiting for.

IPC APEX Expo 2019
IPC APEX Expo 2019

Visit Universal on Booth 2308 on January 29–31 as we celebrate our 100th Anniversary! See demonstrations on some solutions from our comprehensive product portfolio talk with our experts to find out how you can streamline your production flow and maximize productivity.

NEPCON South China 2018
NEPCON South China 2018

Visit Universal on Booth 3141 on February 27 – March 3 and let our experts show how you can maximize efficiency and build better.

MEPTEC 2018
MEPTEC 2018

Visit Universal at the MEPTEC 2018 New Generation Flexible Hybrid Electronics Symposium on April 26 to learn about the leading-edge solutions we offer for current and future FHE challenges. Some of our core competencies include: flex circuit and thin film handling, high-accuracy thin die and passive placement, and ultra-fine pitch placement. Join us at the event to learn more!

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