Blog

Be enlightened with Universal’s Through-Hole Offerings

December 16, 2016
By Kristi Schilloff
Be Enlightened with Universal’s Through-Hole Offerings

You may be surprised to learn that through-hole technology remains a vital part of today’s electronics manufacturing. Refined through decades of experience, Universal’s through-hole lineup continues to stay one step ahead of the growing demands of the industry.

In fact, New York’s Times Square would be dark and boring without the help of our through-hole technology!  Our through-hole machines are used to build products that literally “light up the night”, such as the many large-format LED signs that gives Times Square its iconic look (and feel).

Bright Lights in the Big City!

Bright Lights in the Big City!

Our Radial 88HT Flexible Radial Sequencer Inserter is the right tool for through-hole placement of LEDs for signage as well as illumination.  Our Radial 88HT offers the following:

  • 20k cph real throughput
  • Highest-density dedicated 2.5mm Single Span tooling
  • Inward / outward clinch choices
  • V-groove inward clinch technology eliminates “tiling”, reduces LED twist
  • Alternate Feeder enables non-stop operation
  • Component replenishment without machine stoppage
  • Manual board handling option allows up to 800mm x 800mm boards with park steps

Click below to see a video of our Radial 88HT placing LED components here:

 

Want to learn more about our through-hole offerings, visit our website at:   https://www.uic.com/solutions/through-hole/

 

More Related Posts

The Agile Learner: An Ode to e-Learning

In April 2025, I took my first e-Learning course: Surface Mount Operator Suite. I have no formal education in precision automation solutions for the semiconductor and electronics manufacturing industry. With this being said, I was unsure if I’d be able to comprehend the course material, much less keep up with it. After diving in and now completing the course, I can honestly say it is suitable for anyone with the capacity to learn, and it is more user-friendly than I could’ve anticipated.

“Moore” Is Better with Heterogeneous Integration

As Moore’s Law slows, Heterogeneous Integration (H.I.) is emerging as the smarter path forward—combining multiple specialized dies (logic, memory, RF, power) into one compact, high-performance package. This blog explores how H.I. is transforming everything from smartphones to datacenters, and how advanced platforms like FuzionSC™ + High-Speed Wafer Feeder are simplifying complex multi-die assembly. The result? Faster development, lower costs, and better chips—built for the future.

“Fish-Eyed” Press-Fit Pins Challenges & Solutions

Traditional inspection methods fall short when it comes to next-gen “fish-eyed” press-fit pins—whose flared, asymmetrical geometry makes them nearly impossible to evaluate with 2D vision systems. One misaligned pin on a $15K board can mean catastrophic failure down the line. That’s why we’ve implemented precision 3D laser inspection across our platforms—combining upward and downward vision, sub-micron accuracy, and custom tooling to catch defects in real time and ensure flawless placement the first time, every time.