As Moore’s Law slows, Heterogeneous Integration (H.I.) is emerging as the smarter path forward—combining multiple specialized dies (logic, memory, RF, power) into one compact, high-performance package. This blog explores how H.I. is transforming everything from smartphones to datacenters, and how advanced platforms like FuzionSC™ + High-Speed Wafer Feeder are simplifying complex multi-die assembly. The result? Faster development, lower costs, and better chips—built for the future.

Traditional inspection methods fall short when it comes to next-gen “fish-eyed” press-fit pins—whose flared, asymmetrical geometry makes them nearly impossible to evaluate with 2D vision systems. One misaligned pin on a $15K board can mean catastrophic failure down the line. That’s why we’ve implemented precision 3D laser inspection across our platforms—combining upward and downward vision, sub-micron accuracy, and custom tooling to catch defects in real time and ensure flawless placement the first time, every time.