AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2025 MEETINGS

APRIL MEETING

  
AUTHOR PRESENTATION
  <span class="C9DxTc aw5Odc ">Agenda</span>
Andrew Cao <span class="C9DxTc aw5Odc ">Welcome / Introduction</span>
Ian Tevis <span class="C9DxTc aw5Odc ">Low-Temperature Soldering with Supercooled BiSn Microcapsules</span>
Piyush Kulkarni, Zechen Zhang, Jeff Kurish, Ali Davoodabadi <span class="C9DxTc aw5Odc ">Long Term Thermal Cycle Stability of Vacuum Reflowed Solder TIM</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">Evaluation of High-Reliability Solder Pastes: Thermal Cycle Testing</span>
Alyssa Yaeger <span class="C9DxTc aw5Odc ">Effect of Temperature and Current Pre-Stress on Thermal Cycling</span>
Junbo Yang <span class="C9DxTc aw5Odc ">Comprehensive study of Electromigration in Pb-free Solder with Multi-via Design</span>
Bill Ross <span class="C9DxTc aw5Odc ">Overview of NY CREATES</span>
Michael Meilunas Low Temperature Solder BGA Electromigration Observations and Drop Testing Update
Najmin Sultana Drop and Vibration Durability of High-Reliability Solder Joints
Nikolay Dimitrov Nanoporous Cu-Sn Intermetallic Material for Interconnects in Electronic Packaging
Jeff Kurish, Sankalp Dua Development of UIC Pressure Sintering Testing
Sankalp Dua, Jeff Kurish Atmospheric Oxygen Effects on Commercial Copper Sinter Paste Bond Strength
Jeff Kurish, Sankalp Dua Broadening Scope of Pressure Copper Sinter Bonding Tests
Joseph Brown Vibration Failures in Pre-Stressed Low-Temperature Solder Joints
Najmin Sultana Impact of Temperature and Current Stressing on Solder Joint Shear Strength
Michael Meilunas Cyclomax (SACQ) Reliability Analysis
Jeff Kurish, ZechenZhang Accelerated Thermal Cycling of Mixed Microvia-under-Pad Structures
Michael Meilunas Thermal Cycling of Low Temperature Solders