AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2018 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  <span class="C9DxTc aw5Odc ">Agenda</span>
Jim Wilcox <span class="C9DxTc aw5Odc ">Welcome/Introduction</span><span class="C9DxTc aw5Odc "> </span> 
Pericles Kondos  (presented by J. Wilcox) <span class="C9DxTc aw5Odc ">Sintered Silver Bonding Studies</span>
Luke Wentlent <span class="C9DxTc aw5Odc ">Pb-free Solder Alloy Evaluations</span>
Michael Gaynes (presented by J. Wilcox) <span class="C9DxTc aw5Odc ">Thermal Interface Materials:  Performance & Reliability</span>
Michael Meilunas (presented by J. Wilcox) <span class="C9DxTc aw5Odc ">System in Package (SiP) Interconnect Reliability</span>
Luke Wentlent <span class="C9DxTc aw5Odc ">Area Selective Laser Reflow Assembly</span>
Peter McClure (presented by L. Wentlent) <span class="C9DxTc aw5Odc ">Flexible Electronics Substrate Assembly</span>
Pericles Kondos (presented by J. Wilcox) <span class="C9DxTc aw5Odc ">Mixed VIPPO Array Soldering Defects</span>

MARCH MEETING

 
AUTHOR PRESENTATION
  <span class="C9DxTc aw5Odc ">Agenda</span>
Jim Wilcox <span class="C9DxTc aw5Odc ">Welcome/Introduction</span><span class="C9DxTc aw5Odc "> </span>
Peter McClure <span class="C9DxTc aw5Odc ">APD2B. Flexible Substrate Chip Joining</span>
Peter McClure <span class="C9DxTc aw5Odc ">APD2C. SnAgCu Soldering to Conductive Ink Circuitry</span>  
Luke Wentlent <span class="C9DxTc aw5Odc ">MAT6G. Solder Alloys for Engine Control Applications</span>
Anjani Ladhar <span class="C9DxTc aw5Odc ">PCB Hole Fill Process Capability Study</span> 
Pericles Kondos <span class="C9DxTc aw5Odc ">REL9A. Mixed VIPPO Array BGA Soldering Defects</span>
Peter Borgesen <span class="C9DxTc aw5Odc ">MAT7F. Low Temperature Mixed Solder Assembly: Mechanical Characterization</span> 
Luke Wentlent <span class="C9DxTc aw5Odc ">MAT7F. Low Temperature Mixed Solder Assembly: High Strain Rate Fragility</span>
Divya Choudhary <span class="C9DxTc aw5Odc ">MAT4D. High Performance Die Level Thermal Interface Materials</span> 
Michael Meilunas <span class="C9DxTc aw5Odc ">REL17A. System in Package Interconnect Reliability – SAC305</span>
Michael Meilunas, Pericles Kondos, Michael Gaynes <span class="C9DxTc aw5Odc ">AREA Research Portfolio Briefs – March 2018</span> 
Brook Sandy-Smith <span class="C9DxTc aw5Odc ">IPC Assembly Specification Updates</span>
Fei Dong <span class="C9DxTc aw5Odc ">Conformal Coating for Sn Whisker Mitigation</span> 
Michael Meilunas <span class="C9DxTc aw5Odc ">MAT8B. Conformal Coating Thermal Cycle Reliability Impact</span>
Marie Cole <span class="C9DxTc aw5Odc ">MAT8D. Conformal Coating for Mitigation of S Induced Resistor Corrosion</span> 
Michael Gaynes <span class="C9DxTc aw5Odc ">REL15C. Power Cycle Reliability Testing</span>
Luke Wentlent <span class="C9DxTc aw5Odc ">APD11B. Laser Selective Reflow Assembly and Reliability</span> 
Brian Sohn <span class="C9DxTc aw5Odc ">APD11C. Laser Rework Station Development</span>