AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2024 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  <span class="C9DxTc aw5Odc ">Agenda</span>
Jim Wilcox <span class="C9DxTc aw5Odc ">Welcome / Introduction</span>
Jeff Kurish <span class="C9DxTc aw5Odc ">Further Investigation of Double Reflow BGA with Stacked Microvias</span>
Mohammed Abdel Razzaq <span class="C9DxTc aw5Odc ">FEM Investigation of BGA Solder Joint Residual Stress as a Function of Solidification Temperature</span>
Chris Gastaldo <span class="C9DxTc aw5Odc ">Alternative Methods to Measuring BGAs for Thermal Warpage</span>
Joseph Brown <span class="C9DxTc aw5Odc ">Vibration Fatigue and Shear Strength of High Reliability Solder Alloys</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">Thermal Cycle Reliability Update:  Hybrid Solder Assemblies Using High Reliability Solder Pastes</span>
Alyssa Yaeger <span class="C9DxTc aw5Odc ">Dynamic Alloying of Solder Joints in Low Temperature Solder Assembly of Resistors</span>
Paul Paret Reliability Evaluation of High-Temperature Bonded Interfaces for Automotive Power Electronics
Jeff Kurish Thermal Imaging via Laser Flash Analysis with Spatial Resolution
Piyush Kulkarni Vacuum Reflow of Solder Thermal Interface Materials:  Thermal Cycle Stability
Michael Meilunas Low Temperature Solder Thermal Cycle Experiments with ‘Moderate’Electromigration Stressing
Alyssa Yaeger Effect of Temperature and Current Stress on Thermal Cycling Performance of Low Temperature Solder Alloys
Alyssa Yaeger Explorations in Electromigration Testing
Peter Borgesen Interactions Between Cyclic Loading and Electromigration in SAC305 Solder Joints
Michael Meilunas Low Temperature Solder Current Stressing Effects on Drop Test Performance 2022-2024 Wrap-Up

 

MAY MEETING

 
AUTHOR PRESENTATION
  <span class="C9DxTc aw5Odc ">Agenda</span><span class="C9DxTc aw5Odc "> </span>
Jim Wilcox <span class="C9DxTc aw5Odc ">Welcome / Introduction</span><span class="C9DxTc aw5Odc "> </span>
Martin Anselm <span class="C9DxTc aw5Odc ">Thermal Cycle Performance of Hybrid Low Temperature Solder Joints Tested at a High Homologous Temperature</span>
Nithin Lakshminarayan  Temperature Dependence of Solder Joint Vibration Lifetime Testing 
Piyush Kulkarni <span class="C9DxTc aw5Odc ">Capacitance based Measurements for TIM2 Stability Analysis</span>
Ali Davoodabadi <span class="C9DxTc aw5Odc ">Solder Thermal Interface Process Optimization</span>    
Ali Davoodabadi <span class="C9DxTc aw5Odc ">Thermal Imaging for TIM Evaluation during Power Cycling</span>
Christopher Soles <span class="C9DxTc aw5Odc ">NIST CHIPS Packaging Metrology Overview</span>
Ran Tao <span class="C9DxTc aw5Odc ">What’s Missing in Your Cure Kinetics Model for Advanced Packaging Materials?</span>
Jeff Kurish <span class="C9DxTc aw5Odc ">Double Reflow BGA Defects with Stacked Microvias</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">Accelerated Thermal Cycle Testing Observations</span> 
Joseph Brown and Alyssa Yaeger <span class="C9DxTc aw5Odc ">Embrittlement Due to Gold Surface Finishes in SnPb Joints</span>
Nancy Wang and Alyssa Yaeger <span class="C9DxTc aw5Odc ">Copper Diffusion and Oxidation as a Measure of Shelf-Life and Thermal Stability</span>
Jeff Kurish <span class="C9DxTc aw5Odc ">Laser Reflow Thermal Limitations</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">Test Component Quality Concerns:  An Open Discussion</span>
Alyssa Yaeger <span class="C9DxTc aw5Odc ">High Reliability Solder Device Shear Strength with an Aluminum Clad PCB</span>
Sufyan Tahat  Cyclomax (SAC-Q) Drop Shock Performance
Michael Meilunas High Reliability Hybrid Solder Joints—Preliminary Trials
Peter Borgesen Optimizing Reliability of Solder Joints Reflowed near or below 140C
Alyssa Yaeger Effect of Electromigration Pre-Stress on Thermal Cycle Lifetime
Michael Meilunas Current Stress Effects on Drop Shock Performance of SnBi Low Temperature Solder Joints