AREA CONSORTIUM MEETINGS
AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.
2026 MEETINGS
APRIL MEETING |
|
| AUTHOR | PRESENTATION |
| Agenda | |
| Jeff Kurish | Cross-Sectional Imaging of Soft Indium Solder Thermal Interface Materials with Thermal Cycling |
| Michael Meilunas | Electromigration Update: SAC305 and Cyclomax |
| Jeff Kurish | Process Investigation of Vacuum Reflow Within Multiple Reflow Steps |
| Michael Meilunas | “High Reliability” Solder Paste Performance in Accelerated Thermal Cycling |
| David Vicari | The Future of UIC APL Process and Reliability Research |
| Jeff Kennedy | Large Body BGA Assembly |
| Michael Meilunas | Tin Whisker Measurement Collaboration |
| Wrap-Up Discussion |
For the full meeting recording, please contact a member of the APL.