AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2025 MEETINGS

OCTOBER MEETING

The 2025 AREA Consortium Fall Meeting will be held at the Holiday Inn Binghamton Downtown (2-8 Hawley St, Binghamton, NY 13901) on Thursday, October 16, 2025. Private meetings, group discussions and lab tours may be scheduled for the 15th and 17th by request. Please make your travel plans to join us.

The meeting will feature technical sessions reviewing the latest updates from our research portfolio, invited speakers who will share insights on key topics and emerging trends, and a networking reception which provides a relaxed environment for organic interactions.

APRIL MEETING

  
AUTHOR PRESENTATION
  Agenda
Andrew Cao Welcome / Introduction
Ian Tevis Low-Temperature Soldering with Supercooled BiSn Microcapsules
Piyush Kulkarni, Zechen Zhang, Jeff Kurish, Ali Davoodabadi Long Term Thermal Cycle Stability of Vacuum Reflowed Solder TIM
Michael Meilunas Evaluation of High-Reliability Solder Pastes: Thermal Cycle Testing
Alyssa Yaeger Effect of Temperature and Current Pre-Stress on Thermal Cycling
Junbo Yang Comprehensive study of Electromigration in Pb-free Solder with Multi-via Design
Bill Ross Overview of NY CREATES
Michael Meilunas Low Temperature Solder BGA Electromigration Observations and Drop Testing Update
Najmin Sultana Drop and Vibration Durability of High-Reliability Solder Joints
Nikolay Dimitrov Nanoporous Cu-Sn Intermetallic Material for Interconnects in Electronic Packaging
Jeff Kurish, Sankalp Dua Development of UIC Pressure Sintering Testing
Sankalp Dua, Jeff Kurish Atmospheric Oxygen Effects on Commercial Copper Sinter Paste Bond Strength
Jeff Kurish, Sankalp Dua Broadening Scope of Pressure Copper Sinter Bonding Tests
Joseph Brown Vibration Failures in Pre-Stressed Low-Temperature Solder Joints
Najmin Sultana Impact of Temperature and Current Stressing on Solder Joint Shear Strength
Michael Meilunas Cyclomax (SACQ) Reliability Analysis
Jeff Kurish, ZechenZhang Accelerated Thermal Cycling of Mixed Microvia-under-Pad Structures
Michael Meilunas Thermal Cycling of Low Temperature Solders