AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2021 MEETINGS

OCTOBER MEETING

 
AUTHOR PRESENTATION
  <span class="C9DxTc aw5Odc ">Agenda</span>
Jim Wilcox <span class="C9DxTc aw5Odc ">Welcome</span> 
Michael Meilunas <span class="C9DxTc aw5Odc ">REL20B. Thermal Stability of Electrolytic Capacitors</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">REL20A. Multilayer Ceramic Capacitor Cracking Evaluation</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">MAT2D. Pad Cratering Resistance of Cap Layer Laminates</span>
Pericles Kondos <span class="C9DxTc aw5Odc ">MAT1C. Component Edge Bonding:  Process and Reliability</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">MAT7H. Low Temperature Solder Reliability:  ATC Performance</span>
Dylan Richmond <span class="C9DxTc aw5Odc ">APD11A. BGA Pad Repair using Aerosol Jet Printing</span>
Jim Wilcox, Mohammad Gharabeih, Luke Wentlent <span class="C9DxTc aw5Odc ">REL2B. Drop Shock Modeling:  Effect of Solder Joint Geometry</span>
Jim Wilcox, Michael Meilunas <span class="C9DxTc aw5Odc ">REL10C. Drop Shock Behavior of Hybrid Low Temperature Solder Joints</span>
Ted Jones Qorvo — SHIP-RF Overview (Heterogeneous Integration Packaging prototype facility)
Michael Meilunas <span class="C9DxTc aw5Odc ">REL8B. Underfilled WLCSP Reliability (No-Clean Assembly)</span>
Pericles Kondos <span class="C9DxTc aw5Odc ">MAT3A. “Ni-less ENIG Premium” Surface Finish Evaluation</span>
Christopher Gourlay, Jingwei Xian <span class="C9DxTc aw5Odc ">REL11C. Crystallographic Investigation of Hybrid LTS Ball Drift</span>
Eric Cotts, Faramarz Hadian, Javier Flores, Sitaram Panta <span class="C9DxTc aw5Odc ">REL18B. Current Stressing in Near Eutectic BiSn Low Temperature Solder Alloys</span>
Pericles Kondos <span class="C9DxTc aw5Odc ">MAT6C. Heraeus DA320 Silver Sinter Paste</span>
Peter McClure MAT4D. Liquid Metal Thermal Interface Stability
Peter McClure MAT4E. Thermal Interface Material Testing Apparatus

MARCH MEETING

 
AUTHOR PRESENTATION
  <span class="C9DxTc aw5Odc ">Agenda</span>
Jim Wilcox <span class="C9DxTc aw5Odc ">Welcome/Introduction</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">MAT2D. Laminate Pad Cratering Analysis using Monotonic Bend Test</span>
 Luke Wentlent, Tian Sang <span class="C9DxTc aw5Odc ">REL10C. Solder Alloy Drop Shock Performance</span>
Michael Meilunas <span class="C9DxTc aw5Odc ">MAT3B. Reliability of Electrolytic Pd, Autocatalytic Au (EPAG) Surface Finish</span>
Luke Wentlent, Michael Meilunas <span class="C9DxTc aw5Odc ">MAT7H. Low Temperature Solder Reliability:  0/100C ATC Performance and ATC Profile Effects</span>
Peter McClure, Dylan Richmond <span class="C9DxTc aw5Odc ">MAT4B.  Graphite Thermal Pad Reliability Testing</span>
Peter McClure <span class="C9DxTc aw5Odc ">REL17A.  Interval Testing TIMs in ATC — Experimental Design and Debug</span>
Eckardt Bihler <span class="C9DxTc aw5Odc ">Dyconex — Reliability and Biostability of Bio-Electronic Implants</span>
Pericles Kondos <span class="C9DxTc aw5Odc ">MAT4D.  Liquid Metal Thermal Interface Material Processing</span>
Jan Gilldorf <span class="C9DxTc aw5Odc ">Saab — Solderability and Wetting of Immersion Tin Finish</span>
Faramarz Hadian, Eric Cotts <span class="C9DxTc aw5Odc ">Electromigration in Homogeneous Near Eutectic BiSn Solder Joints</span>
Luke Wentlent <span class="C9DxTc aw5Odc ">MAT7A.  Thermal Cycle Dwell Time Effects in High Reliability Solders</span>
Pericles Kondos, Xinyu Zhang <span class="C9DxTc aw5Odc ">MAT1C.  Component Edge Bonding:  Process and Reliability</span>
Pericles Kondos, Xinyu Zhang <span class="C9DxTc aw5Odc ">MAT1C.  Component Edge Bonding:  Rework Process Trials</span>
Pericles Kondos <span class="C9DxTc aw5Odc ">REL9A.  PCB Thermal Response of Mixed VIPPO BGA Array</span>