AREA CONSORTIUM MEETINGS

AREA Consortium meetings are typically held three times a year. These meetings provide our members with an opportunity to review our progress, ask questions, and help with the interpretation.

2011 MEETINGS

OCTOBER MEETING

  
AUTHOR PRESENTATION
  Meeting Agenda
  Attendees
  PCB Issues
Liang Yin Creep Corrosion – Creep Corrosion – SWF file
Brian Roggeman Pad Cratering: Design Overview
Brian Roggeman Updates on ZetaCap Project
Pericles Kondos Pad Cratering in Rework – Pad Cratering in Rework – SWF file
  Assembly
Brian Roggeman TMV PoP Assembly
Pericles Kondos Epoxy Flux – Epoxy Flux – SWF file
Michael Meilunas Head in Pillow Inspection Project – Detecting Head in Pillow Defects – SWF file
  Reliability
Michael Meilunas Thermal Cycling Projects Update – Thermal Cycling Projects Update – SWF file
Peter Borgesen Reliability Model
Younis Jaradat Varying Cycling Amplitude – Varying Cycling Amplitude – SWF file
  Lead-Free Characterization
Hohyung Lee Measuring Creep using DIC
Babak Arfaei Controlling Microstructure – Controlling Microstructure – SWF file
Liang Yin Microstructure Evolution during Fatigue – Microstructure Evolution during Fatigue – SWF file
Awni Qasaimeh Damage Evolution in Cycling – Damage Evolution in Cycling – SWF file
  Other
Stephan Meschter SERDP Whisker Project
Bahgat Sammakia Energy Efficient Data Centers
   

JUNE MEETING

  
AUTHOR PRESENTATION
Brian Roggeman Pad Cratering: Effects of ZetaCap
Pradosh Guruprasad Cratering in Shock
Pericles Kondos Effect of Latent Laminate Damage on Cratering
Babak Arafei Controlling SnAgCu Structures: Part I
Babak Arafei Controlling SnAgCu Structures: Part II
Michael Meilunas Update on Thermal Cycling
Awni Qasaimeh On the Track of a Damage Function for Cycling of SnAgCu
Younis Jaradat Effects of Varying the Cycle Amplitude
Luke Wentlent More on Amplitude Variation
Liang Yin Creep Corrosion
Pericles Kondos ENEPIG
Martin Anselm Intermetallic Bond Issues on ENIG
David Rae Thermal Interface Tapes
David Rae TIM Printing and Cook-Book