Upcoming Events

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    SMTA International 2016

    Visit Universal on Booth #807 on September 27–28 and see how our solutions experts can help with your specific production challenges.

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    SMT Hybrid Packaging 2016

    Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.

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    NEPCON China 2016

    Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.

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    APEX 2016

    Visit Universal on Booth 2441 at the 2016 IPC APEX EXPO 2016 on March 15–17 and see two pioneering additions to the industry’s most comprehensive solutions portfolio: the Uflex™ modular automation platform and the Flexbond™ hot bar bonding platform.

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    SEMICON China 2016

    Visit Universal on Channel Partner Sigmatek’s Booth# 1531 at SEMICON Shanghai 2016 on March 15–17 and learn how Universal’s team of solutions experts can help solve your manufacturing challenges.