2010s

    • With our strong core product portfolio and stellar industry expertise, company transitions into a provider of comprehensive line solutions
    • Lightning™ Head upgraded and renamed as FZ30™; provides significant improvements in accuracy & reliability
    • Continuous investment in R & D leads to significant product launches, including:
      • Flagship Fuzion® Platform family  launched, providing the industry’s highest utilization and versatility
      • Launch of Uflex™; a revolutionary new flexible automation platform enables a full range of custom processes on a standard cell to maximize re-configurability and minimize time to market
      • Flexbond™ launch secures Universal position in the hot-bar bonding market
      • FuzionSC™ delivers accuracy and throughput over the largest work area for today’s advanced packaging applications
    • Universal’s APL helps their customer develop a high yield medical device (heart catheter) and bring it to market with material selection, design and process development
  • Breadth of product line and expertise at integrating 3rd party equipment allows Universal to deliver strong line solutions in a variety of markets

  • The Fuzion® product family is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance.

  • AdvantisV™ is Universal’s next-generation midrange platform that combines the best in technology and performance with a low entry price and unmatched scalability.

  • The second iteration of IM equipment, Generation 88HT insertion mount, becomes the established industry standard for throughput, flexibility and reliability with the launch of the Radial 88HT; bringing a new level of productivity to radial component sequencing and insertion, offering consistently high throughput regardless of component type.

  • Uflex™ delivers economical single-process automation for a wide range of assembly tasks. This versatile solution is reconfigurable allowing for adaption to the next application challenge to get products to market fast and improve ROI.

  • FuzionSC™(pictured above) is Universal’s next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range.

  • The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications.

  • Universal’s APL worked with the world’s largest supplier in the industry to develop a robust high-volume manufacturing process for an IVUS catheter; helping them to achieve 99%+ yields within 12 months. At the time of production the catheter board was the finest-pitch soldered flip chip interconnect in the world!

  • A couple additional points in history:

    • European offices centrally relocated to Bratislava, Slovakia. New facility includes space for training and spare parts warehouse space
    • Advantis 3™ Platform & FuzionXC2-37 were presented with prestigious New Product Introduction (NPI) Awards from the industry-leading publication, Circuits Assembly
    • MyUniversal website launched containing secure customer-specific information; allows customers to order spare parts, check on status of orders, etc.
    • State-of-the-Art Training & Demo center opened in Shanghai; Open house event held
    • New website launched with updated branding; available in English, Chinese & German
    • Universal’s training center began offering eLearning, supplementing its course portfolio with the addition of a series of online training courses