2000s

    • The revolutionary Lightning™ Head is introduced. This 30-spindle high-speed chip placement head strengthens Universal’s position in the mid-range and high-speed flexible market
    • Key products introduced:
      • The release of the HSP 4797 launches company into the high-speed chip placement market
      • GSM Genesis™ platform  is released as the next generation dual-beam platform
      • Single-beam AdVantis™ platform is introduced to address the mid-range market
      • Introduction of Polaris Jr. complements the existing Polaris Multi-process assembly cell
      • Quadris™, a quad-beam SMT placement system, hits the high-speed market
      • Dimensions™ Manufacturing software; a leading-edge factory automation software to optimize efficiency and productivity, is launched
    • Jean-Luc Pelissier takes the reins to become Universal’s eleventh (and current) President & CEO
  • Ian McEvoy becomes Universal’s 8th President

  • Polaris handles odd form assembly for light mechanical processes as diverse as medical instruments, small automotive subassemblies, toys and games, and office products. First production Polaris Assembly Cell shipped to Alcatel, France – Europe’s largest communications company.

  • Polaris Jr. is an Economical, single-process final assembly providing the exact amount of functionality to meet specific requirements.

  • 4797 HSP places components from miniature SMD passives to large, fine pitch QFPs, BGAs, or CSPs at a rate of 48,000 cph

  • Introduction of the Lightning™ head; a 30-spindle high-speed head used for chip placement

  • GSM Genesis is introduced: flexible fine pitch placement system with PTF (Platform Tray Feeder) pictured above.

  • Advantis™ is designed to place chips, fine pitch semiconductors or odd-form components.

  • Quadris quad-beam placement systems delivered concentrated throughput of 62,000cph.

  • Jean-Luc Pelissier was appointed Universal’s President & CEO in October 2007. Previously, he was president of NPTest, managing the development and sales of semiconductor test equipment platforms until its acquisition by Credence.

  • Keith O’Leary, joined Universal as Chief Financial Officer in June 2008. Previously, he was CEO of SCP Global Technologies, Inc. managing the wafer cleaning tool manufacturing, service and spares businesses.

  • A couple additional points in history:

    • Universal celebrated a historic event with recognition of Don Finney’s 50th year anniversary with the company – the first person in Universal’s history to attain 50 years of service.
    • Suzhou Technology Excellence Center opened in Jiangsu Province, China- a showcase for Universal equipment and process and service support.
    • Universal opens a state-of-the-art 4700 square meter manufacturing facility in Guangdong Province, China.
    • A sharp industry downturn occurs, which will last over two years.
    • Universal begins consolidating all divisions into the recently purchased 200,000 square foot Conklin South facility.