Universal Features Fuzion Solutions at Productronica 2013

Versatile platform portfolio optimizes efficiency to boost productivity and lower costs in all manufacturing environments.

November 5, 2013 – Universal Instruments is bringing its award-winning Fuzion™ solutions to the European market at Productronica 2013 in Munich, Germany, November 12 – 15. On Hall A2, Booth 435, the company will showcase customer-focused solutions that maximize return on investment by leveraging a comprehensive range of innovative technologies and exclusive process expertise.

“We’re excited to demonstrate the value of Fuzion here at the industry’s premier trade show,” said Universal’s Vice President of Sales, Brad Bennett. “While our FuzionXC™ has been awarded for its unique advantages in higher-mix environments, we’re eager to highlight the ability of our comprehensive Fuzion portfolio to deliver these same benefits to high- and medium-volume manufacturers,” he added.

Fuzion leverages a true platform concept, featuring single-, dual-, quad-beam, and XC (extra capacity) variants that take advantage of Universal’s new ion™ feeders and Fuzion software tools to create line and factory solutions that are perfectly suited to any production model.

For high-volume production, Fuzion facilitates the lowest cost per placement and operating costs, sustained productivity, and superior yields. In higher-mix environments, Fuzion maximizes agility by streamlining NPI and changeovers, allowing manufacturers to accommodate the most diverse revenue stream and produce a full range of products in a lean environment.

Bennett further commented, “Fuzion’s versatility has already proven a successful foundation for operational excellence for a wide range of industry leaders across all production environments, including the fast-growing Automotive, Industrial, and Medical European market segments.”

Universal’s Surface Mount solutions complement the industry’s most expansive technology portfolio across the assembly market, including Insertion Mount, Advanced Packaging, Automation, and Component and Die Handling, to ensure the optimal solution regardless of production goals.

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