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The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines with Universal Instruments’ Fuzion® Platform for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.

These configurable solutions have been shown to provide 6X to 12X the throughput of traditional semi-automated assembly stations and more than twice that of alternative automated hot bar solutions while reducing floor space requirements by 80%. They also require significantly fewer machines and offer the lowest OPEX and $/cph/m2.

  • The first high-throughput automated hot bar bonding platform
  • Industry-best performance and a maximum bonding rate of 1800 UPH
  • Dual-zone parallel processing with up to 6 heads per zone, 12 heads total (4X alternative solutions)
  • Programmable, closed-loop temperature control ensures alignment with solder profiles
  • Under-board constant heat balances thermal load for flex-to-flex applications
  • Programmable pressure settings and high-accuracy management provide superior bonding control
  • Conveyor-style architecture with adjustable width adapts to range of applications

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Downloads & Resources

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